JPS577941A - Discriminating method for semiconductor chip - Google Patents

Discriminating method for semiconductor chip

Info

Publication number
JPS577941A
JPS577941A JP8240680A JP8240680A JPS577941A JP S577941 A JPS577941 A JP S577941A JP 8240680 A JP8240680 A JP 8240680A JP 8240680 A JP8240680 A JP 8240680A JP S577941 A JPS577941 A JP S577941A
Authority
JP
Japan
Prior art keywords
defective
acceptable
seal
chip
discriminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8240680A
Other languages
Japanese (ja)
Inventor
Kinnosuke Okutsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8240680A priority Critical patent/JPS577941A/en
Publication of JPS577941A publication Critical patent/JPS577941A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To discriminate and display an acceptable or a defective positively and easily by pasting seals for discrimination on a semiconductor chip in response to the discriminating signals of the acceptable or the defective transmitted from a testing system. CONSTITUTION:When the acceptable or defective chip is discriminated by utilizing the reflection of light, a circular seal 11 is formed using a substance reflecting light such as aluminum or glass powder as a material. When the chip is discriminated by utilizing magnetism, the seal is formed using iron powder as a material. With the seal 11, adhesives 12 are glued on the back, and it is made tape-shaped as 13. The seal is interlocked with the testing system for the acceptable or the defective, and the seal 11 is pasted on the surface of the defective chip on a wafer 15 by using a cylindrical tube 14 and a nozzle 17. Accordingly, the acceptable or the defective can easily be discriminated and displayed positively because ink, etc. are not used.
JP8240680A 1980-06-18 1980-06-18 Discriminating method for semiconductor chip Pending JPS577941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8240680A JPS577941A (en) 1980-06-18 1980-06-18 Discriminating method for semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8240680A JPS577941A (en) 1980-06-18 1980-06-18 Discriminating method for semiconductor chip

Publications (1)

Publication Number Publication Date
JPS577941A true JPS577941A (en) 1982-01-16

Family

ID=13773705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8240680A Pending JPS577941A (en) 1980-06-18 1980-06-18 Discriminating method for semiconductor chip

Country Status (1)

Country Link
JP (1) JPS577941A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58188286U (en) * 1982-06-07 1983-12-14 本田技研工業株式会社 Motorcycle interlocking brake device
JPS5987837A (en) * 1982-11-10 1984-05-21 Fujitsu Ltd Semiconductor device
JPH0837210A (en) * 1994-07-22 1996-02-06 Nec Kyushu Ltd Method of preserving mapping data of semiconductor wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58188286U (en) * 1982-06-07 1983-12-14 本田技研工業株式会社 Motorcycle interlocking brake device
JPS6218154Y2 (en) * 1982-06-07 1987-05-11
JPS5987837A (en) * 1982-11-10 1984-05-21 Fujitsu Ltd Semiconductor device
JPH043665B2 (en) * 1982-11-10 1992-01-23
JPH0837210A (en) * 1994-07-22 1996-02-06 Nec Kyushu Ltd Method of preserving mapping data of semiconductor wafer

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