JPS5776854A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5776854A
JPS5776854A JP15259480A JP15259480A JPS5776854A JP S5776854 A JPS5776854 A JP S5776854A JP 15259480 A JP15259480 A JP 15259480A JP 15259480 A JP15259480 A JP 15259480A JP S5776854 A JPS5776854 A JP S5776854A
Authority
JP
Japan
Prior art keywords
kinds
diodes
circuits
semiconductor wafer
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15259480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216009B2 (enrdf_load_stackoverflow
Inventor
Yukio Minato
Katsu Sanada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15259480A priority Critical patent/JPS5776854A/ja
Publication of JPS5776854A publication Critical patent/JPS5776854A/ja
Publication of JPS6216009B2 publication Critical patent/JPS6216009B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP15259480A 1980-10-30 1980-10-30 Semiconductor device Granted JPS5776854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15259480A JPS5776854A (en) 1980-10-30 1980-10-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15259480A JPS5776854A (en) 1980-10-30 1980-10-30 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5776854A true JPS5776854A (en) 1982-05-14
JPS6216009B2 JPS6216009B2 (enrdf_load_stackoverflow) 1987-04-10

Family

ID=15543842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15259480A Granted JPS5776854A (en) 1980-10-30 1980-10-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5776854A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996833U (ja) * 1982-12-20 1984-06-30 クラリオン株式会社 半導体装置
JPS59115642U (ja) * 1983-01-26 1984-08-04 日本電気アイシ−マイコンシステム株式会社 半導体ウエフア
JPS59159948U (ja) * 1983-04-12 1984-10-26 日本電気株式会社 集積回路装置
JPS59215717A (ja) * 1983-05-24 1984-12-05 Nec Corp 半導体集積回路装置の製造方法
JPS62199026A (ja) * 1986-02-26 1987-09-02 Fujitsu Ltd 半導体装置の製造方法
JPH03273502A (ja) * 1990-03-23 1991-12-04 Matsushita Electric Ind Co Ltd 回転ヘッド装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996833U (ja) * 1982-12-20 1984-06-30 クラリオン株式会社 半導体装置
JPS59115642U (ja) * 1983-01-26 1984-08-04 日本電気アイシ−マイコンシステム株式会社 半導体ウエフア
JPS59159948U (ja) * 1983-04-12 1984-10-26 日本電気株式会社 集積回路装置
JPS59215717A (ja) * 1983-05-24 1984-12-05 Nec Corp 半導体集積回路装置の製造方法
JPS62199026A (ja) * 1986-02-26 1987-09-02 Fujitsu Ltd 半導体装置の製造方法
JPH03273502A (ja) * 1990-03-23 1991-12-04 Matsushita Electric Ind Co Ltd 回転ヘッド装置

Also Published As

Publication number Publication date
JPS6216009B2 (enrdf_load_stackoverflow) 1987-04-10

Similar Documents

Publication Publication Date Title
DE3571535D1 (en) Integrated circuit semiconductor device formed on a wafer
GB2088635B (en) Encapsulation for semiconductor integrated circuit chip
TW339455B (en) An electrode structure of semiconductor integrated circuit and method for forming the package therefor
FR2532784B1 (fr) Dispositif a circuits integres a semiconducteurs comprenant une gorge profonde remplie d'un materiau isolant et procede de fabrication d'un tel dispositif
EP0304263A3 (en) Semiconductor chip assembly
JPS5731166A (en) Semiconductor device
EP0353426A3 (en) Semiconductor integrated circuit device comprising conductive layers
JPS5759372A (en) Circuit structure altering device for integrated semiconductor circuit
EP1051746A4 (en) INTEGRATED SEMICONDUCTOR CIRCUIT COMPONENT
EP0157675A3 (en) Spinning device for processing a substrate, in particular a semiconductor wafer
DE3166106D1 (en) A semiconductor integrated circuit device with an improved heat sink
DE3176822D1 (en) Semiconductor device having a device state identifying circuit
DE3571700D1 (en) Semiconductor integrated circuit device having a test circuit
DE3270326D1 (en) Semiconductor integrated-circuit device with test circuit
DE3479547D1 (en) Bipolar transistor mos transistor hybrid semiconductor integrated circuit device
JPS5776854A (en) Semiconductor device
DE3370407D1 (en) Package for a semiconductor chip with lead terminals
EP0066836A3 (en) Method of marking semiconductor chips, and marked semiconductor chip
EP0144865A3 (en) Semiconductor wafer with an electrically-isolated semiconductor device
JPS54148485A (en) Test method for semiconductor device
JPS55165657A (en) Multi-chip package
DE3375861D1 (en) Leadless chip carrier semiconductor integrated circuit device
JPS57190344A (en) Master slice semiconductor integrated circuit device
JPS6480037A (en) Semiconductor integrated circuit device
JPS5360169A (en) Semiconductor integrated circuit device