JPS5772349A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS5772349A JPS5772349A JP55148770A JP14877080A JPS5772349A JP S5772349 A JPS5772349 A JP S5772349A JP 55148770 A JP55148770 A JP 55148770A JP 14877080 A JP14877080 A JP 14877080A JP S5772349 A JPS5772349 A JP S5772349A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wirings
- width
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55148770A JPS5772349A (en) | 1980-10-23 | 1980-10-23 | Semiconductor integrated circuit device |
US06/311,805 US4467345A (en) | 1980-10-23 | 1981-10-15 | Semiconductor integrated circuit device |
GB8131461A GB2088629B (en) | 1980-10-23 | 1981-10-19 | Improvements in semiconductor integrated circuit devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55148770A JPS5772349A (en) | 1980-10-23 | 1980-10-23 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5772349A true JPS5772349A (en) | 1982-05-06 |
Family
ID=15460262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55148770A Pending JPS5772349A (en) | 1980-10-23 | 1980-10-23 | Semiconductor integrated circuit device |
Country Status (3)
Country | Link |
---|---|
US (1) | US4467345A (ja) |
JP (1) | JPS5772349A (ja) |
GB (1) | GB2088629B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63293855A (ja) * | 1987-05-26 | 1988-11-30 | Nec Ic Microcomput Syst Ltd | 半導体装置 |
JPS6457732A (en) * | 1987-08-28 | 1989-03-06 | Matsushita Electronics Corp | Semiconductor device |
US4835591A (en) * | 1987-12-29 | 1989-05-30 | Mitsubishi Denki Kabushiki Kaisha | Wiring arrangement for semiconductor devices |
US5101261A (en) * | 1988-09-09 | 1992-03-31 | Texas Instruments Incorporated | Electronic circuit device with electronomigration-resistant metal conductors |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594050A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | 半導体装置 |
JPS6010645A (ja) * | 1983-06-30 | 1985-01-19 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS61193454A (ja) * | 1985-02-20 | 1986-08-27 | Mitsubishi Electric Corp | 半導体装置 |
US5182235A (en) * | 1985-02-20 | 1993-01-26 | Mitsubishi Denki Kabushiki Kaisha | Manufacturing method for a semiconductor device having a bias sputtered insulating film |
US4695868A (en) * | 1985-12-13 | 1987-09-22 | Rca Corporation | Patterned metallization for integrated circuits |
US5570119A (en) * | 1988-07-26 | 1996-10-29 | Canon Kabushiki Kaisha | Multilayer device having integral functional element for use with an ink jet recording apparatus, and recording apparatus |
US5212503A (en) * | 1988-07-26 | 1993-05-18 | Canon Kabushiki Kaisha | Liquid jet recording head having a substrate with minimized electrode overlap |
DE69233550T2 (de) * | 1991-01-22 | 2006-06-22 | Nec Corp. | Plastikumhüllte integrierte Halbleiterschaltung mit einer Verdrahtungschicht |
EP0747930B1 (en) * | 1995-05-19 | 2000-09-27 | STMicroelectronics S.r.l. | Electronic device with multiple bonding wires, method of fabrication and method of testing bonding wire integrity |
JP3123450B2 (ja) * | 1996-11-26 | 2001-01-09 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US6555910B1 (en) * | 2000-08-29 | 2003-04-29 | Agere Systems Inc. | Use of small openings in large topography features to improve dielectric thickness control and a method of manufacture thereof |
KR100410990B1 (ko) * | 2001-02-20 | 2003-12-18 | 삼성전자주식회사 | 다층배선을 갖는 반도체 장치 및 그의 제조방법 |
US7863746B2 (en) | 2001-02-20 | 2011-01-04 | Mosaid Technologies Incorporated | Semiconductor device having metal lines with slits |
JP4626919B2 (ja) * | 2001-03-27 | 2011-02-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN1267780C (zh) * | 2002-11-11 | 2006-08-02 | Lg.飞利浦Lcd有限公司 | 用于液晶显示器的阵列基板及其制造方法 |
US6818996B2 (en) * | 2002-12-20 | 2004-11-16 | Lsi Logic Corporation | Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps |
WO2005048314A2 (en) * | 2003-11-12 | 2005-05-26 | Silicon Pipe, Inc. | Tapered dielectric and conductor structures and applications thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54133090A (en) * | 1978-04-07 | 1979-10-16 | Cho Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3632433A (en) * | 1967-03-29 | 1972-01-04 | Hitachi Ltd | Method for producing a semiconductor device |
US3620837A (en) * | 1968-09-16 | 1971-11-16 | Ibm | Reliability of aluminum and aluminum alloy lands |
NL163370C (nl) * | 1972-04-28 | 1980-08-15 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon. |
US4109275A (en) * | 1976-12-22 | 1978-08-22 | International Business Machines Corporation | Interconnection of integrated circuit metallization |
JPS5444881A (en) * | 1977-09-16 | 1979-04-09 | Nec Corp | Electrode wiring structure of integrated circuit |
-
1980
- 1980-10-23 JP JP55148770A patent/JPS5772349A/ja active Pending
-
1981
- 1981-10-15 US US06/311,805 patent/US4467345A/en not_active Expired - Lifetime
- 1981-10-19 GB GB8131461A patent/GB2088629B/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54133090A (en) * | 1978-04-07 | 1979-10-16 | Cho Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63293855A (ja) * | 1987-05-26 | 1988-11-30 | Nec Ic Microcomput Syst Ltd | 半導体装置 |
JPS6457732A (en) * | 1987-08-28 | 1989-03-06 | Matsushita Electronics Corp | Semiconductor device |
US4835591A (en) * | 1987-12-29 | 1989-05-30 | Mitsubishi Denki Kabushiki Kaisha | Wiring arrangement for semiconductor devices |
US5101261A (en) * | 1988-09-09 | 1992-03-31 | Texas Instruments Incorporated | Electronic circuit device with electronomigration-resistant metal conductors |
Also Published As
Publication number | Publication date |
---|---|
US4467345A (en) | 1984-08-21 |
GB2088629A (en) | 1982-06-09 |
GB2088629B (en) | 1984-09-26 |
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