JPS5759457U - - Google Patents
Info
- Publication number
- JPS5759457U JPS5759457U JP1980136418U JP13641880U JPS5759457U JP S5759457 U JPS5759457 U JP S5759457U JP 1980136418 U JP1980136418 U JP 1980136418U JP 13641880 U JP13641880 U JP 13641880U JP S5759457 U JPS5759457 U JP S5759457U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980136418U JPS6138193Y2 (https=) | 1980-09-25 | 1980-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980136418U JPS6138193Y2 (https=) | 1980-09-25 | 1980-09-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5759457U true JPS5759457U (https=) | 1982-04-08 |
| JPS6138193Y2 JPS6138193Y2 (https=) | 1986-11-05 |
Family
ID=29496532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980136418U Expired JPS6138193Y2 (https=) | 1980-09-25 | 1980-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138193Y2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4893303B2 (ja) * | 2006-12-29 | 2012-03-07 | 株式会社デンソー | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53133571U (https=) * | 1977-03-29 | 1978-10-23 |
-
1980
- 1980-09-25 JP JP1980136418U patent/JPS6138193Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53133571U (https=) * | 1977-03-29 | 1978-10-23 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6138193Y2 (https=) | 1986-11-05 |