JPS575879Y2 - - Google Patents
Info
- Publication number
- JPS575879Y2 JPS575879Y2 JP1977029601U JP2960177U JPS575879Y2 JP S575879 Y2 JPS575879 Y2 JP S575879Y2 JP 1977029601 U JP1977029601 U JP 1977029601U JP 2960177 U JP2960177 U JP 2960177U JP S575879 Y2 JPS575879 Y2 JP S575879Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977029601U JPS575879Y2 (US20110009641A1-20110113-C00116.png) | 1977-03-14 | 1977-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977029601U JPS575879Y2 (US20110009641A1-20110113-C00116.png) | 1977-03-14 | 1977-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53124647U JPS53124647U (US20110009641A1-20110113-C00116.png) | 1978-10-04 |
| JPS575879Y2 true JPS575879Y2 (US20110009641A1-20110113-C00116.png) | 1982-02-03 |
Family
ID=28877676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977029601U Expired JPS575879Y2 (US20110009641A1-20110113-C00116.png) | 1977-03-14 | 1977-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS575879Y2 (US20110009641A1-20110113-C00116.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023169577A (ja) * | 2022-05-17 | 2023-11-30 | 株式会社 日立パワーデバイス | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4951872A (US20110009641A1-20110113-C00116.png) * | 1972-06-13 | 1974-05-20 |
-
1977
- 1977-03-14 JP JP1977029601U patent/JPS575879Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4951872A (US20110009641A1-20110113-C00116.png) * | 1972-06-13 | 1974-05-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53124647U (US20110009641A1-20110113-C00116.png) | 1978-10-04 |
