JPS5756930A - Wafer washing and drying device - Google Patents

Wafer washing and drying device

Info

Publication number
JPS5756930A
JPS5756930A JP55131992A JP13199280A JPS5756930A JP S5756930 A JPS5756930 A JP S5756930A JP 55131992 A JP55131992 A JP 55131992A JP 13199280 A JP13199280 A JP 13199280A JP S5756930 A JPS5756930 A JP S5756930A
Authority
JP
Japan
Prior art keywords
wafer
carrier
arm
moved
adherence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55131992A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317224B2 (https=
Inventor
Mikio Nishihata
Katsumi Minazu
Kazuo Horie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55131992A priority Critical patent/JPS5756930A/ja
Publication of JPS5756930A publication Critical patent/JPS5756930A/ja
Publication of JPS6317224B2 publication Critical patent/JPS6317224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP55131992A 1980-09-22 1980-09-22 Wafer washing and drying device Granted JPS5756930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55131992A JPS5756930A (en) 1980-09-22 1980-09-22 Wafer washing and drying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55131992A JPS5756930A (en) 1980-09-22 1980-09-22 Wafer washing and drying device

Publications (2)

Publication Number Publication Date
JPS5756930A true JPS5756930A (en) 1982-04-05
JPS6317224B2 JPS6317224B2 (https=) 1988-04-13

Family

ID=15071017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55131992A Granted JPS5756930A (en) 1980-09-22 1980-09-22 Wafer washing and drying device

Country Status (1)

Country Link
JP (1) JPS5756930A (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129374A (ja) * 1983-01-17 1984-07-25 株式会社日立製作所 洗浄乾燥装置
JPS59215729A (ja) * 1983-05-21 1984-12-05 Ulvac Corp 半導体もしくは磁気記録媒体等の基板の洗浄装置
JPS60223130A (ja) * 1984-04-19 1985-11-07 Sharp Corp 基板の洗滌乾燥方法及びその装置
JPS60254620A (ja) * 1984-05-31 1985-12-16 Fujitsu Ltd ウエハーの乾燥方法および装置
JPS6143430A (ja) * 1984-08-07 1986-03-03 Mitsubishi Electric Corp カセツト洗浄装置
JPS61170034A (ja) * 1985-01-23 1986-07-31 Hitachi Ltd 洗浄装置
JPS62293617A (ja) * 1986-06-13 1987-12-21 Oki Electric Ind Co Ltd 半導体ウエハ遠心乾燥装置
JPH01130771A (ja) * 1987-10-05 1989-05-23 Nukem Gmbh 基板洗浄法及び基板洗浄装置
USRE37627E1 (en) 1986-06-12 2002-04-09 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
JP2014103274A (ja) * 2012-11-20 2014-06-05 Shindengen Electric Mfg Co Ltd レジスト現像装置、レジスト現像方法及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831886U (https=) * 1971-08-21 1973-04-18
JPS5389671A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Continuous treating apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831886U (https=) * 1971-08-21 1973-04-18
JPS5389671A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Continuous treating apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129374A (ja) * 1983-01-17 1984-07-25 株式会社日立製作所 洗浄乾燥装置
JPS59215729A (ja) * 1983-05-21 1984-12-05 Ulvac Corp 半導体もしくは磁気記録媒体等の基板の洗浄装置
JPS60223130A (ja) * 1984-04-19 1985-11-07 Sharp Corp 基板の洗滌乾燥方法及びその装置
JPS60254620A (ja) * 1984-05-31 1985-12-16 Fujitsu Ltd ウエハーの乾燥方法および装置
JPS6143430A (ja) * 1984-08-07 1986-03-03 Mitsubishi Electric Corp カセツト洗浄装置
JPS61170034A (ja) * 1985-01-23 1986-07-31 Hitachi Ltd 洗浄装置
USRE37627E1 (en) 1986-06-12 2002-04-09 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
JPS62293617A (ja) * 1986-06-13 1987-12-21 Oki Electric Ind Co Ltd 半導体ウエハ遠心乾燥装置
JPH01130771A (ja) * 1987-10-05 1989-05-23 Nukem Gmbh 基板洗浄法及び基板洗浄装置
JP2014103274A (ja) * 2012-11-20 2014-06-05 Shindengen Electric Mfg Co Ltd レジスト現像装置、レジスト現像方法及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6317224B2 (https=) 1988-04-13

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