JPS5756219B2 - - Google Patents
Info
- Publication number
- JPS5756219B2 JPS5756219B2 JP48023823A JP2382373A JPS5756219B2 JP S5756219 B2 JPS5756219 B2 JP S5756219B2 JP 48023823 A JP48023823 A JP 48023823A JP 2382373 A JP2382373 A JP 2382373A JP S5756219 B2 JPS5756219 B2 JP S5756219B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/05—Filamentary, e.g. strands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/06—Rod-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/13—Articles with a cross-section varying in the longitudinal direction, e.g. corrugated pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Rectifiers (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Television Scanning (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US231311A US3869701A (en) | 1972-03-02 | 1972-03-02 | Plurality of electronic elements connected together by interconnecting wires and connecting joints |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS48100617A JPS48100617A (US20020095090A1-20020718-M00002.png) | 1973-12-19 |
| JPS5756219B2 true JPS5756219B2 (US20020095090A1-20020718-M00002.png) | 1982-11-29 |
Family
ID=22868695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48023823A Expired JPS5756219B2 (US20020095090A1-20020718-M00002.png) | 1972-03-02 | 1973-03-01 |
Country Status (8)
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178458U (US20020095090A1-20020718-M00002.png) * | 1981-05-08 | 1982-11-11 | ||
| JPS5839216A (ja) * | 1981-08-31 | 1983-03-07 | アイシン・エィ・ダブリュ株式会社 | 油圧機器における電線の連結封止方法および装置 |
| FR2549291B2 (fr) * | 1982-10-29 | 1986-05-09 | Radiotechnique Compelec | Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques |
| FR2535526B1 (fr) * | 1982-10-29 | 1986-03-28 | Radiotechnique Compelec | Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques |
| USRE32829E (en) * | 1984-09-10 | 1989-01-10 | General Instrument Corp. | Rectifier with slug construction and mold for fabricating same |
| US4564885A (en) * | 1984-09-10 | 1986-01-14 | General Instrument Corporation | Rectifier with slug construction and mold for fabricating same |
| FR2585892B1 (fr) * | 1985-08-05 | 1987-11-20 | Girard Francois | Dispositif de miniaturisation des connexions d'elements soumis a de tres fortes intensites electriques |
| US5194692A (en) * | 1990-09-27 | 1993-03-16 | Amphenol Corporation | Uncased data bus coupler |
| GB2284305B (en) * | 1991-03-13 | 1995-10-11 | Standard Products Co | Electroluminescent light strip |
| JPH0817113B2 (ja) * | 1991-03-13 | 1996-02-21 | ザ スタンダード プロダクツ カンパニー | エレクトロルミネッセントライトストリップ |
| US6113248A (en) * | 1997-10-20 | 2000-09-05 | The Standard Products Company | Automated system for manufacturing an LED light strip having an integrally formed connector |
| US6061902A (en) * | 1998-04-21 | 2000-05-16 | Dalhousie University | Method for recovering leads embedded within a composite structure |
| DE19933772A1 (de) * | 1999-07-19 | 2001-02-08 | Metzeler Automotive Profiles | Anschlußstück |
| US7120347B2 (en) | 2004-01-27 | 2006-10-10 | Corning Cable Systems Llc | Multi-port optical connection terminal |
| US7680388B2 (en) | 2004-11-03 | 2010-03-16 | Adc Telecommunications, Inc. | Methods for configuring and testing fiber drop terminals |
| US7489849B2 (en) | 2004-11-03 | 2009-02-10 | Adc Telecommunications, Inc. | Fiber drop terminal |
| CA2604948A1 (en) | 2005-04-19 | 2006-10-26 | Adc Telecommunications, Inc. | Loop back plug and method |
| US7418177B2 (en) | 2005-11-10 | 2008-08-26 | Adc Telecommunications, Inc. | Fiber optic cable breakout system, packaging arrangement, and method of installation |
| US7422378B2 (en) | 2006-03-09 | 2008-09-09 | Adc Telecommunications, Inc. | Fiber optic cable breakout configuration with excess fiber length |
| US7424189B2 (en) | 2006-03-09 | 2008-09-09 | Adc Telecommunications, Inc. | Mid-span breakout with potted closure |
| US7317863B2 (en) | 2006-03-09 | 2008-01-08 | Adc Telecommunications, Inc. | Fiber optic cable breakout configuration with retention block |
| US7251411B1 (en) | 2006-03-09 | 2007-07-31 | Adc Telecommunication, Inc. | Fiber optic cable breakout configuration with “Y” block |
| US7590321B2 (en) | 2006-03-09 | 2009-09-15 | Adc Telecommunications, Inc. | Mid-span breakout with helical fiber routing |
| US7599598B2 (en) | 2006-08-09 | 2009-10-06 | Adc Telecommunications, Inc. | Cable payout systems and methods |
| US7840109B2 (en) * | 2006-08-14 | 2010-11-23 | Adc Telecommunications, Inc. | Factory spliced cable assembly |
| WO2008021253A2 (en) | 2006-08-14 | 2008-02-21 | Adc Telecommunications, Inc. | Factory spliced cable assembly |
| US7289714B1 (en) | 2006-09-26 | 2007-10-30 | Adc Telecommunication, Inc. | Tubing wrap procedure |
| US7480436B2 (en) | 2006-10-10 | 2009-01-20 | Adc Telecommunications, Inc. | Systems and methods for securing a tether to a distribution cable |
| US7403685B2 (en) | 2006-10-13 | 2008-07-22 | Adc Telecommunications, Inc. | Overmold zip strip |
| US7489843B2 (en) | 2007-02-06 | 2009-02-10 | Adc Telecommunications, Inc. | Polyurethane to polyethylene adhesion process |
| US7558458B2 (en) | 2007-03-08 | 2009-07-07 | Adc Telecommunications, Inc. | Universal bracket for mounting a drop terminal |
| US7532799B2 (en) | 2007-04-12 | 2009-05-12 | Adc Telecommunications | Fiber optic telecommunications cable assembly |
| US7609925B2 (en) | 2007-04-12 | 2009-10-27 | Adc Telecommunications, Inc. | Fiber optic cable breakout configuration with tensile reinforcement |
| US7769261B2 (en) | 2007-09-05 | 2010-08-03 | Adc Telecommunications, Inc. | Fiber optic distribution cable |
| US7740409B2 (en) | 2007-09-19 | 2010-06-22 | Corning Cable Systems Llc | Multi-port optical connection terminal |
| US9188759B2 (en) * | 2008-10-14 | 2015-11-17 | Corning Cable Systems Llc | Optical connection terminal having port mapping scheme |
| WO2011143401A2 (en) | 2010-05-14 | 2011-11-17 | Adc Telecommunications, Inc. | Splice enclosure arrangement for fiber optic cables |
| CN103221863B (zh) | 2010-10-28 | 2016-06-01 | 康宁光缆系统有限责任公司 | 抗冲击光纤外壳及相关方法 |
| US8885998B2 (en) | 2010-12-09 | 2014-11-11 | Adc Telecommunications, Inc. | Splice enclosure arrangement for fiber optic cables |
| US9069151B2 (en) | 2011-10-26 | 2015-06-30 | Corning Cable Systems Llc | Composite cable breakout assembly |
| US8873926B2 (en) | 2012-04-26 | 2014-10-28 | Corning Cable Systems Llc | Fiber optic enclosures employing clamping assemblies for strain relief of cables, and related assemblies and methods |
| US20140060622A1 (en) * | 2012-08-31 | 2014-03-06 | Primestar Solar, Inc. | Direct connection of lead bar to conductive ribbon in a thin film photovoltaic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913091U (US20020095090A1-20020718-M00002.png) * | 1972-05-11 | 1974-02-04 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3264248A (en) * | 1959-12-03 | 1966-08-02 | Gen Electric | Encapsulating compositions containing an epoxy resin, metaxylylene diamine, and tris-beta chlorethyl phosphate, and encapsulated modules |
| US3179853A (en) * | 1960-02-29 | 1965-04-20 | Chase Shawmut Co | Integral semiconductor diode and diode-fuse unit |
| US3045199A (en) * | 1960-12-12 | 1962-07-17 | Stackpole Carbon Co | Engine ignition system cable |
| US3152293A (en) * | 1960-12-16 | 1964-10-06 | Ruben Samuel | Sealed semiconductor device and mounting means therefor |
| GB976441A (en) * | 1962-10-10 | 1964-11-25 | Lucas Industries Ltd | Diodes |
| GB984902A (en) * | 1963-01-18 | 1965-03-03 | Tmm Research Ltd | Improvements in drawtwister and draw-winder machines for processing synthetic textile filaments |
| US3291894A (en) * | 1966-04-19 | 1966-12-13 | Hollingsworth Solderless Termi | Electrical component with terminal lugs |
| US3492157A (en) * | 1966-06-20 | 1970-01-27 | Tokyo Shibaura Electric Co | Resin-sealed semiconductor device and manufacturing method for the same |
| US3483440A (en) * | 1966-09-08 | 1969-12-09 | Int Rectifier Corp | Plastic coated semiconductor device for high-voltage low-pressure application |
| US3476988A (en) * | 1968-01-31 | 1969-11-04 | Westinghouse Electric Corp | Resin encapsulated semiconductor device |
-
1972
- 1972-03-02 US US231311A patent/US3869701A/en not_active Expired - Lifetime
-
1973
- 1973-02-21 CA CA164,221A patent/CA979999A/en not_active Expired
- 1973-02-27 DE DE19732309719 patent/DE2309719A1/de active Pending
- 1973-02-28 NL NL7302760A patent/NL7302760A/xx not_active Application Discontinuation
- 1973-02-28 GB GB1066373A patent/GB1383735A/en not_active Expired
- 1973-03-01 SE SE7302884A patent/SE391837B/xx unknown
- 1973-03-01 FR FR7307337A patent/FR2174241B3/fr not_active Expired
- 1973-03-01 JP JP48023823A patent/JPS5756219B2/ja not_active Expired
- 1973-04-23 US US231311A patent/US3845552A/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913091U (US20020095090A1-20020718-M00002.png) * | 1972-05-11 | 1974-02-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS48100617A (US20020095090A1-20020718-M00002.png) | 1973-12-19 |
| US3845552A (en) | 1974-11-05 |
| US3869701A (en) | 1975-03-04 |
| FR2174241A1 (US20020095090A1-20020718-M00002.png) | 1973-10-12 |
| NL7302760A (US20020095090A1-20020718-M00002.png) | 1973-09-04 |
| CA979999A (en) | 1975-12-16 |
| DE2309719A1 (de) | 1973-09-13 |
| FR2174241B3 (US20020095090A1-20020718-M00002.png) | 1976-03-05 |
| SE391837B (sv) | 1977-02-28 |
| GB1383735A (en) | 1974-02-12 |
