JPS5747578A - Heat insulating material filled type soldering vessel - Google Patents

Heat insulating material filled type soldering vessel

Info

Publication number
JPS5747578A
JPS5747578A JP12103980A JP12103980A JPS5747578A JP S5747578 A JPS5747578 A JP S5747578A JP 12103980 A JP12103980 A JP 12103980A JP 12103980 A JP12103980 A JP 12103980A JP S5747578 A JPS5747578 A JP S5747578A
Authority
JP
Japan
Prior art keywords
solder
heat insulating
temp
vessel
decreases
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12103980A
Other languages
Japanese (ja)
Inventor
Mitsumasa Kobayashi
Shigeo Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Engineering Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Engineering Co Ltd
Priority to JP12103980A priority Critical patent/JPS5747578A/en
Publication of JPS5747578A publication Critical patent/JPS5747578A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To stabilize the temp. of molten solder and prevent solder ejection by filling heat insulating materials into the space between a vessel and an outer case.
CONSTITUTION: Heat insulating materials 6 are filled on side faces (4 places) and bottom part (one place) in the space between the stainless steel vessel 2 and outer case 3 of a soldering vessel. This decreases the temp. drop of solder, makes up the low heat conductivity of solder which is the prime cause for solder ejection that occurs during melting of solder, decreases the temp. difference between the solder surface (the part in contact with air) and the bottom part and decreases the solder ejection. Since the temp. drop of the solder is prevented, saving of electric power and the reduction in starting time are made possible.
COPYRIGHT: (C)1982,JPO&Japio
JP12103980A 1980-09-03 1980-09-03 Heat insulating material filled type soldering vessel Pending JPS5747578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12103980A JPS5747578A (en) 1980-09-03 1980-09-03 Heat insulating material filled type soldering vessel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12103980A JPS5747578A (en) 1980-09-03 1980-09-03 Heat insulating material filled type soldering vessel

Publications (1)

Publication Number Publication Date
JPS5747578A true JPS5747578A (en) 1982-03-18

Family

ID=14801298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12103980A Pending JPS5747578A (en) 1980-09-03 1980-09-03 Heat insulating material filled type soldering vessel

Country Status (1)

Country Link
JP (1) JPS5747578A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013141668A (en) * 2012-01-06 2013-07-22 Tamura Seisakusho Co Ltd Solder bath

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013141668A (en) * 2012-01-06 2013-07-22 Tamura Seisakusho Co Ltd Solder bath

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