JPS5747578A - Heat insulating material filled type soldering vessel - Google Patents
Heat insulating material filled type soldering vesselInfo
- Publication number
- JPS5747578A JPS5747578A JP12103980A JP12103980A JPS5747578A JP S5747578 A JPS5747578 A JP S5747578A JP 12103980 A JP12103980 A JP 12103980A JP 12103980 A JP12103980 A JP 12103980A JP S5747578 A JPS5747578 A JP S5747578A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- heat insulating
- temp
- vessel
- decreases
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To stabilize the temp. of molten solder and prevent solder ejection by filling heat insulating materials into the space between a vessel and an outer case.
CONSTITUTION: Heat insulating materials 6 are filled on side faces (4 places) and bottom part (one place) in the space between the stainless steel vessel 2 and outer case 3 of a soldering vessel. This decreases the temp. drop of solder, makes up the low heat conductivity of solder which is the prime cause for solder ejection that occurs during melting of solder, decreases the temp. difference between the solder surface (the part in contact with air) and the bottom part and decreases the solder ejection. Since the temp. drop of the solder is prevented, saving of electric power and the reduction in starting time are made possible.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12103980A JPS5747578A (en) | 1980-09-03 | 1980-09-03 | Heat insulating material filled type soldering vessel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12103980A JPS5747578A (en) | 1980-09-03 | 1980-09-03 | Heat insulating material filled type soldering vessel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5747578A true JPS5747578A (en) | 1982-03-18 |
Family
ID=14801298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12103980A Pending JPS5747578A (en) | 1980-09-03 | 1980-09-03 | Heat insulating material filled type soldering vessel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5747578A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013141668A (en) * | 2012-01-06 | 2013-07-22 | Tamura Seisakusho Co Ltd | Solder bath |
-
1980
- 1980-09-03 JP JP12103980A patent/JPS5747578A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013141668A (en) * | 2012-01-06 | 2013-07-22 | Tamura Seisakusho Co Ltd | Solder bath |
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