JPS5724026B2 - - Google Patents
Info
- Publication number
- JPS5724026B2 JPS5724026B2 JP5069777A JP5069777A JPS5724026B2 JP S5724026 B2 JPS5724026 B2 JP S5724026B2 JP 5069777 A JP5069777 A JP 5069777A JP 5069777 A JP5069777 A JP 5069777A JP S5724026 B2 JPS5724026 B2 JP S5724026B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5069777A JPS53136479A (en) | 1977-05-04 | 1977-05-04 | Automatic alignment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5069777A JPS53136479A (en) | 1977-05-04 | 1977-05-04 | Automatic alignment method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53136479A JPS53136479A (en) | 1978-11-29 |
| JPS5724026B2 true JPS5724026B2 (US06174465-20010116-C00003.png) | 1982-05-21 |
Family
ID=12866096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5069777A Granted JPS53136479A (en) | 1977-05-04 | 1977-05-04 | Automatic alignment method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53136479A (US06174465-20010116-C00003.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115521U (US06174465-20010116-C00003.png) * | 1988-01-28 | 1989-08-03 | ||
| JPH0514827Y2 (US06174465-20010116-C00003.png) * | 1987-04-07 | 1993-04-20 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849629Y2 (ja) * | 1978-07-03 | 1983-11-12 | 三菱電機株式会社 | 半導体装置用容器 |
| JPS6169142A (ja) * | 1985-06-21 | 1986-04-09 | Hitachi Ltd | ワイヤボンデイング装置 |
-
1977
- 1977-05-04 JP JP5069777A patent/JPS53136479A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0514827Y2 (US06174465-20010116-C00003.png) * | 1987-04-07 | 1993-04-20 | ||
| JPH01115521U (US06174465-20010116-C00003.png) * | 1988-01-28 | 1989-08-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53136479A (en) | 1978-11-29 |
