JPS572313A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS572313A
JPS572313A JP7563880A JP7563880A JPS572313A JP S572313 A JPS572313 A JP S572313A JP 7563880 A JP7563880 A JP 7563880A JP 7563880 A JP7563880 A JP 7563880A JP S572313 A JPS572313 A JP S572313A
Authority
JP
Japan
Prior art keywords
ether
compound
triallyl cyanurate
heat
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7563880A
Other languages
Japanese (ja)
Other versions
JPS6320243B2 (en
Inventor
Akio Nishikawa
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7563880A priority Critical patent/JPS572313A/en
Publication of JPS572313A publication Critical patent/JPS572313A/en
Publication of JPS6320243B2 publication Critical patent/JPS6320243B2/ja
Granted legal-status Critical Current

Links

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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

PURPOSE: The titled composition, consisting of an ether-imide compound and a triallyl cyanurate compound, capable of giving a cured article having a high strength at a high temperature by heating at a relatively low temperature in a relatively short time, moldable at a low pressure, and having improved heat resistance, etc.
CONSTITUTION: A composition prepared by incorporating (A) 100pts.wt. ether- imide compound expressed by the formula (R1, R2, R3 and R4 are H, lower alkyl, lower alkoxyl, Cl or Br; R5 and R6 are H, methyl, ethyl, trifluoromethyl or trichloromethyl; D is 2W24C bifunctional organic group), e.g. 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, with (B) preferably 50W350pts.wt., triallyl cyanurate compound, preferably an allylic ester of a polycarboxylic acid or cyanuric acid such as triallyl trimellitate. Preferably, an organic peroxide, e.g. benzoyl peroxide, is added thereto as a polymerization initiator.
COPYRIGHT: (C)1982,JPO&Japio
JP7563880A 1980-06-06 1980-06-06 Heat-resistant resin composition Granted JPS572313A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7563880A JPS572313A (en) 1980-06-06 1980-06-06 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7563880A JPS572313A (en) 1980-06-06 1980-06-06 Heat-resistant resin composition

Publications (2)

Publication Number Publication Date
JPS572313A true JPS572313A (en) 1982-01-07
JPS6320243B2 JPS6320243B2 (en) 1988-04-27

Family

ID=13581989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7563880A Granted JPS572313A (en) 1980-06-06 1980-06-06 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS572313A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01305427A (en) * 1988-06-02 1989-12-08 Fujitsu Ltd Rom card control system

Also Published As

Publication number Publication date
JPS6320243B2 (en) 1988-04-27

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