JPS572313A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS572313A JPS572313A JP7563880A JP7563880A JPS572313A JP S572313 A JPS572313 A JP S572313A JP 7563880 A JP7563880 A JP 7563880A JP 7563880 A JP7563880 A JP 7563880A JP S572313 A JPS572313 A JP S572313A
- Authority
- JP
- Japan
- Prior art keywords
- ether
- compound
- triallyl cyanurate
- heat
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE: The titled composition, consisting of an ether-imide compound and a triallyl cyanurate compound, capable of giving a cured article having a high strength at a high temperature by heating at a relatively low temperature in a relatively short time, moldable at a low pressure, and having improved heat resistance, etc.
CONSTITUTION: A composition prepared by incorporating (A) 100pts.wt. ether- imide compound expressed by the formula (R1, R2, R3 and R4 are H, lower alkyl, lower alkoxyl, Cl or Br; R5 and R6 are H, methyl, ethyl, trifluoromethyl or trichloromethyl; D is 2W24C bifunctional organic group), e.g. 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, with (B) preferably 50W350pts.wt., triallyl cyanurate compound, preferably an allylic ester of a polycarboxylic acid or cyanuric acid such as triallyl trimellitate. Preferably, an organic peroxide, e.g. benzoyl peroxide, is added thereto as a polymerization initiator.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7563880A JPS572313A (en) | 1980-06-06 | 1980-06-06 | Heat-resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7563880A JPS572313A (en) | 1980-06-06 | 1980-06-06 | Heat-resistant resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS572313A true JPS572313A (en) | 1982-01-07 |
JPS6320243B2 JPS6320243B2 (en) | 1988-04-27 |
Family
ID=13581989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7563880A Granted JPS572313A (en) | 1980-06-06 | 1980-06-06 | Heat-resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS572313A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01305427A (en) * | 1988-06-02 | 1989-12-08 | Fujitsu Ltd | Rom card control system |
-
1980
- 1980-06-06 JP JP7563880A patent/JPS572313A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6320243B2 (en) | 1988-04-27 |
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