JPS5721324Y2 - - Google Patents
Info
- Publication number
- JPS5721324Y2 JPS5721324Y2 JP1977038261U JP3826177U JPS5721324Y2 JP S5721324 Y2 JPS5721324 Y2 JP S5721324Y2 JP 1977038261 U JP1977038261 U JP 1977038261U JP 3826177 U JP3826177 U JP 3826177U JP S5721324 Y2 JPS5721324 Y2 JP S5721324Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977038261U JPS5721324Y2 (https=) | 1977-03-29 | 1977-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977038261U JPS5721324Y2 (https=) | 1977-03-29 | 1977-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53133571U JPS53133571U (https=) | 1978-10-23 |
| JPS5721324Y2 true JPS5721324Y2 (https=) | 1982-05-08 |
Family
ID=28902878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977038261U Expired JPS5721324Y2 (https=) | 1977-03-29 | 1977-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5721324Y2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6138193Y2 (https=) * | 1980-09-25 | 1986-11-05 | ||
| JP2705030B2 (ja) * | 1989-02-23 | 1998-01-26 | 凸版印刷株式会社 | リードフレームおよび放熱板および半導体装置 |
| JP2013222714A (ja) * | 2012-04-12 | 2013-10-28 | Denso Corp | 半導体装置の製造方法 |
-
1977
- 1977-03-29 JP JP1977038261U patent/JPS5721324Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53133571U (https=) | 1978-10-23 |