JPS57211258A - Cooling device for semiconductor device - Google Patents
Cooling device for semiconductor deviceInfo
- Publication number
- JPS57211258A JPS57211258A JP9598081A JP9598081A JPS57211258A JP S57211258 A JPS57211258 A JP S57211258A JP 9598081 A JP9598081 A JP 9598081A JP 9598081 A JP9598081 A JP 9598081A JP S57211258 A JPS57211258 A JP S57211258A
- Authority
- JP
- Japan
- Prior art keywords
- bag
- rubber
- plates
- circumference
- rest
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain sufficient cooling effect without giving concentrated stress by a method wherein the bottom face of the bag type container with sealed liquid type refrigerant is partially formed by the material which can be formed into a rigid body, and the rigid part is contacted to the back side of chips. CONSTITUTION:Small plates 7a, which were hardened by mixing Al powder with Si rubber, are arranged on a rest D, the clearance between the plates is buried by pouring Si rubber into it, the plates are peeled off the rest D after hardening, they are pressed to the prescribed thickness, and a film 5b is formed. Si rubber film 5a is superposed on the above, and the bag type container 5 is formed by adhering the circumference, and a copper pipe 8 is arranged in such a manner that it makes a zigzag line in the bag. The circumference of the bag 5 is pinched between Al frames 11 and 12, tightened by a bolt 13 and the bag 5 is covered from above a substrate 1. When a proper quantity of pure water 6 is poured 10 into the bag and the bag is maintained in a freely transformable state, the bag 5 hangs down due to the weight of the pure water, the rigid body 7 comes in contact with the corresponding chips 2 lightly and uniformly under the prescribed pressure without allowing the generation of transformation and the concentrated stress. Also, since the thermal resistance can be maintained at a sufficiently low level, a satisfactory cooling effect can be obtained without characteristic deterioration and breakdown on the semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9598081A JPS57211258A (en) | 1981-06-23 | 1981-06-23 | Cooling device for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9598081A JPS57211258A (en) | 1981-06-23 | 1981-06-23 | Cooling device for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57211258A true JPS57211258A (en) | 1982-12-25 |
Family
ID=14152301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9598081A Pending JPS57211258A (en) | 1981-06-23 | 1981-06-23 | Cooling device for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57211258A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6037757A (en) * | 1983-08-10 | 1985-02-27 | Mitsubishi Electric Corp | Semiconductor device |
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
US6504720B2 (en) | 2000-09-25 | 2003-01-07 | Kabushiki Kaisha Toshiba | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
CN105828538A (en) * | 2016-05-19 | 2016-08-03 | 张惠莹 | Resistor and conductor welding device |
CN105934096A (en) * | 2016-05-19 | 2016-09-07 | 张惠莹 | Welding apparatus for lead wire and copper pipe |
CN106216892A (en) * | 2016-05-19 | 2016-12-14 | 张惠莹 | Circuit board resistance and the automatic welding device of copper pipe |
-
1981
- 1981-06-23 JP JP9598081A patent/JPS57211258A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
JPS6037757A (en) * | 1983-08-10 | 1985-02-27 | Mitsubishi Electric Corp | Semiconductor device |
US6504720B2 (en) | 2000-09-25 | 2003-01-07 | Kabushiki Kaisha Toshiba | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
CN106216893A (en) * | 2016-05-19 | 2016-12-14 | 张惠莹 | Circuit board resistance and the automatic welding machine of copper pipe |
CN105934096A (en) * | 2016-05-19 | 2016-09-07 | 张惠莹 | Welding apparatus for lead wire and copper pipe |
CN106216892A (en) * | 2016-05-19 | 2016-12-14 | 张惠莹 | Circuit board resistance and the automatic welding device of copper pipe |
CN105828538A (en) * | 2016-05-19 | 2016-08-03 | 张惠莹 | Resistor and conductor welding device |
CN106271240A (en) * | 2016-05-19 | 2017-01-04 | 张惠莹 | Circuit board resistance and the automatic soldering device of copper pipe |
CN106271240B (en) * | 2016-05-19 | 2018-05-25 | 佛山市顺德区凯祥电器有限公司 | The automatic soldering device of circuit board resistance and copper pipe |
CN106216893B (en) * | 2016-05-19 | 2018-06-05 | 中山市兴杰电器有限公司 | The automatic welding machine of circuit board resistance and copper pipe |
CN106216892B (en) * | 2016-05-19 | 2018-08-03 | 日照东泰铜业合金有限公司 | The automatic welding device of circuit board resistance and copper pipe |
CN105934096B (en) * | 2016-05-19 | 2019-01-04 | 李成城 | The welder of conducting wire and copper pipe |
CN105828538B (en) * | 2016-05-19 | 2019-01-04 | 李成城 | The welder of resistance and conducting wire |
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