JPS57202727A - Method and device for heat treatment - Google Patents

Method and device for heat treatment

Info

Publication number
JPS57202727A
JPS57202727A JP56088396A JP8839681A JPS57202727A JP S57202727 A JPS57202727 A JP S57202727A JP 56088396 A JP56088396 A JP 56088396A JP 8839681 A JP8839681 A JP 8839681A JP S57202727 A JPS57202727 A JP S57202727A
Authority
JP
Japan
Prior art keywords
core tube
substrate
tube
heat treatment
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56088396A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227724B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Keiichi Kagawa
Kiyohiro Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56088396A priority Critical patent/JPS57202727A/ja
Publication of JPS57202727A publication Critical patent/JPS57202727A/ja
Publication of JPS6227724B2 publication Critical patent/JPS6227724B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP56088396A 1981-06-09 1981-06-09 Method and device for heat treatment Granted JPS57202727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56088396A JPS57202727A (en) 1981-06-09 1981-06-09 Method and device for heat treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56088396A JPS57202727A (en) 1981-06-09 1981-06-09 Method and device for heat treatment

Publications (2)

Publication Number Publication Date
JPS57202727A true JPS57202727A (en) 1982-12-11
JPS6227724B2 JPS6227724B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-16

Family

ID=13941627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56088396A Granted JPS57202727A (en) 1981-06-09 1981-06-09 Method and device for heat treatment

Country Status (1)

Country Link
JP (1) JPS57202727A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161711A (ja) * 1985-01-11 1986-07-22 Denkoo:Kk 半導体の熱処理方法及び熱処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353965U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-10-08 1978-05-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353965U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-10-08 1978-05-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161711A (ja) * 1985-01-11 1986-07-22 Denkoo:Kk 半導体の熱処理方法及び熱処理装置

Also Published As

Publication number Publication date
JPS6227724B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-16

Similar Documents

Publication Publication Date Title
JPS57153995A (en) Method and device for adjusting flow rate of gas
JPS5755806A (en) Manufacture of vessel from heat sealing plastic pipe and its device and vessel manufactured through said method and device
DE3060785D1 (en) Method of growing plasma oxide on semiconductor substrates and device for carrying out this method
JPS57189021A (en) Method and device for mass flow rate
EP0140340A3 (en) Gas sensor with ceramics substrate and method for producing the same
AU1297183A (en) Temperature actuated air flow control and gas sampler
GB2070327B (en) Method and apparatus for annealing semiconductors
DE3273562D1 (en) Method and apparatus for controlling thermal growth
DE3177017D1 (en) Method for reducing oxygen precipitation in silicon wafers
JPS57202727A (en) Method and device for heat treatment
JPS56165317A (en) Manufacture of semiconductor device
JPS54978A (en) Semiconductor device of glass seal type
AU572259B2 (en) Method and apparatus for annealing metal parts
AU547624B2 (en) Heating device for open kilns with revoling fire and method for implementing such device
DE3070834D1 (en) Process for fabricating thin metal superconducting films of improved thermal cyclability and device
JPS5423379A (en) Formation of insulating film on semiconductor surface
JPS549582A (en) Sealing method of semiconductor device
JPS57113701A (en) Manufacture and manufacturing device of duct type trolley
GB2069678B (en) Process and device for regulating the temperature of the hot air in an installation for the production of hot air
JPS52135993A (en) Neutron detector for measuring inside of reactor
JPS5694760A (en) Semiconductor device
JPS556449A (en) Controlling method for rate of metallization of reduced substance in suspending layer
JPS57134936A (en) Forming method of insulation film on compound semiconductor
JPS57103316A (en) Manufacture of compound semiconductor device
GB2078358B (en) A cooling tower and method for the stabilisation of the boundary flow in the cooling tower