JPS57201953A - Information transmitting method of multiple cpu system - Google Patents
Information transmitting method of multiple cpu systemInfo
- Publication number
- JPS57201953A JPS57201953A JP56085979A JP8597981A JPS57201953A JP S57201953 A JPS57201953 A JP S57201953A JP 56085979 A JP56085979 A JP 56085979A JP 8597981 A JP8597981 A JP 8597981A JP S57201953 A JPS57201953 A JP S57201953A
- Authority
- JP
- Japan
- Prior art keywords
- control systems
- circuits
- coupled
- control system
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
- G06F15/80—Architectures of general purpose stored program computers comprising an array of processing units with common control, e.g. single instruction multiple data processors
- G06F15/8007—Architectures of general purpose stored program computers comprising an array of processing units with common control, e.g. single instruction multiple data processors single instruction multiple data [SIMD] multiprocessors
Abstract
PURPOSE:To simplify an interchange of information among control systems, by interchanging information invariably according to a certain information interchange procedure without discriminating between the normal state and abnormal state of each control system circuit of an information processing control system. CONSTITUTION:The control system A and control system B of a multiple CPU system are coupled by circuits a1 and a2, the control systems A and C are coupled by circuits b1 and b2, and the control systems C and D are coupled by circuits C1 and C2; and the control systems D and B are coupled by circuits d1 and d2, and the control systems B and C are coupled by circuits e1 and e2, and the control systems A and D are coupled by circuits f1 and f2. Transmission between control systems employs a full duplex system, and from the control system A to the control system B, data frames C and D are transmitted in addition to a data frame A generated at the control system A. Transmission from other control systems is the same, and a data frame other than data generated at a transmission destination is transmitted to other control systems.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56085979A JPS57201953A (en) | 1981-06-03 | 1981-06-03 | Information transmitting method of multiple cpu system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56085979A JPS57201953A (en) | 1981-06-03 | 1981-06-03 | Information transmitting method of multiple cpu system |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57201953A true JPS57201953A (en) | 1982-12-10 |
Family
ID=13873821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56085979A Pending JPS57201953A (en) | 1981-06-03 | 1981-06-03 | Information transmitting method of multiple cpu system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57201953A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008209113A (en) * | 2007-02-23 | 2008-09-11 | Toyo Seiki Seisakusho:Kk | Test piece supply device of impact resilience testing machine |
US9759641B2 (en) | 2009-11-27 | 2017-09-12 | Hysitron, Inc. | Micro electro-mechanical heater |
US9804072B2 (en) | 2011-11-28 | 2017-10-31 | Hysitron, Inc. | High temperature heating system |
US9829417B2 (en) | 2012-06-13 | 2017-11-28 | Hysitron, Inc. | Environmental conditioning assembly for use in mechanical testing at micron or nano-scales |
-
1981
- 1981-06-03 JP JP56085979A patent/JPS57201953A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008209113A (en) * | 2007-02-23 | 2008-09-11 | Toyo Seiki Seisakusho:Kk | Test piece supply device of impact resilience testing machine |
US9759641B2 (en) | 2009-11-27 | 2017-09-12 | Hysitron, Inc. | Micro electro-mechanical heater |
US9804072B2 (en) | 2011-11-28 | 2017-10-31 | Hysitron, Inc. | High temperature heating system |
US10241017B2 (en) | 2011-11-28 | 2019-03-26 | Bruker Nano, Inc. | High temperature heating system |
US9829417B2 (en) | 2012-06-13 | 2017-11-28 | Hysitron, Inc. | Environmental conditioning assembly for use in mechanical testing at micron or nano-scales |
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