JPS57181119A - Forming method for pattern - Google Patents
Forming method for patternInfo
- Publication number
- JPS57181119A JPS57181119A JP6624381A JP6624381A JPS57181119A JP S57181119 A JPS57181119 A JP S57181119A JP 6624381 A JP6624381 A JP 6624381A JP 6624381 A JP6624381 A JP 6624381A JP S57181119 A JPS57181119 A JP S57181119A
- Authority
- JP
- Japan
- Prior art keywords
- film
- pattern
- alpha3
- poly
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000001312 dry etching Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000005224 laser annealing Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- High Energy & Nuclear Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To form a substance changing section corresponding to a desired pattern on a substrate by making energy beam itself possess necessary pattern information or pattern distribution. CONSTITUTION:An insulating film alpha2 made of SiO2 is shaped onto the Si substrate alpha1, and an amorphous Si film alpha3 is further deposited. Partial pulse laser annealing is conducted to the film 3. That is, the film alpha3 is changed into poly Si as a substance change through a melting reaction by giving energy beam itself the pattern information and irradiating the film alpha3, and a poly Si pattern is formed. An island alpha4 mde of poly Si is shaped according to the difference of the speed of etching through dry etching. Consequently, a process can be turned in a resistless dry process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6624381A JPS57181119A (en) | 1981-05-01 | 1981-05-01 | Forming method for pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6624381A JPS57181119A (en) | 1981-05-01 | 1981-05-01 | Forming method for pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57181119A true JPS57181119A (en) | 1982-11-08 |
Family
ID=13310223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6624381A Pending JPS57181119A (en) | 1981-05-01 | 1981-05-01 | Forming method for pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57181119A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59155935A (en) * | 1983-02-25 | 1984-09-05 | Agency Of Ind Science & Technol | Forming method of pattern by using plasma |
JPS59165422A (en) * | 1983-03-10 | 1984-09-18 | Agency Of Ind Science & Technol | Dry process apparatus |
JPS60101932A (en) * | 1983-11-08 | 1985-06-06 | Agency Of Ind Science & Technol | Formation of pattern |
JPS60216555A (en) * | 1984-04-12 | 1985-10-30 | Fuji Electric Corp Res & Dev Ltd | Manufacture of semiconductor device |
JPH01259530A (en) * | 1988-04-11 | 1989-10-17 | Tokyo Electron Ltd | Processing apparatus |
JPH01274432A (en) * | 1988-04-27 | 1989-11-02 | Nec Corp | Film forming method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53132270A (en) * | 1977-04-20 | 1978-11-17 | Thomson Csf | Optical device for projecting pattern |
JPS54131866A (en) * | 1978-04-05 | 1979-10-13 | Nippon Telegr & Teleph Corp <Ntt> | Heat treatment device |
-
1981
- 1981-05-01 JP JP6624381A patent/JPS57181119A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53132270A (en) * | 1977-04-20 | 1978-11-17 | Thomson Csf | Optical device for projecting pattern |
JPS54131866A (en) * | 1978-04-05 | 1979-10-13 | Nippon Telegr & Teleph Corp <Ntt> | Heat treatment device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59155935A (en) * | 1983-02-25 | 1984-09-05 | Agency Of Ind Science & Technol | Forming method of pattern by using plasma |
JPH0526329B2 (en) * | 1983-02-25 | 1993-04-15 | Kogyo Gijutsuin | |
JPS59165422A (en) * | 1983-03-10 | 1984-09-18 | Agency Of Ind Science & Technol | Dry process apparatus |
JPS60101932A (en) * | 1983-11-08 | 1985-06-06 | Agency Of Ind Science & Technol | Formation of pattern |
JPS60216555A (en) * | 1984-04-12 | 1985-10-30 | Fuji Electric Corp Res & Dev Ltd | Manufacture of semiconductor device |
JPH01259530A (en) * | 1988-04-11 | 1989-10-17 | Tokyo Electron Ltd | Processing apparatus |
JPH01274432A (en) * | 1988-04-27 | 1989-11-02 | Nec Corp | Film forming method |
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