JPS57166054A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS57166054A
JPS57166054A JP56051082A JP5108281A JPS57166054A JP S57166054 A JPS57166054 A JP S57166054A JP 56051082 A JP56051082 A JP 56051082A JP 5108281 A JP5108281 A JP 5108281A JP S57166054 A JPS57166054 A JP S57166054A
Authority
JP
Japan
Prior art keywords
resin
novolak type
added
epoxy
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56051082A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56051082A priority Critical patent/JPS57166054A/en
Publication of JPS57166054A publication Critical patent/JPS57166054A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To perform resin sealing of a semiconductor device having high reliability and favorable productivity by a method wherein a compound formed by adding novolak type phenol resin hardener, organic phosphine hardening accelerator, sorbitol ester, and inorganic filler to novolak type epoxy resin having the prescribed epoxy equivalent is used. CONSTITUTION:Novolak type phenol novolak resin, etc., having 3% or less of resin compound being soluble in water at the normal temperature and having 60-100 deg.C softening point is used as the hardener for phenol novolak type epoxy resin, etc., having the 170-300 epoxy equivalent, and the compounding ratio is suppressed within 0.5-1.5 of the numeral ratio of phenolhydroxyl group and epoxy group. Moreover triphenylphosphine is added by about 0.01-10wt% of resin to accelerate hardening. Then sorbian monolaurate is added by 0.01- 10wt% of resin and quartz glass powder is added by about 1.5-4wt% of resin, and mixing treatment and molding are performed to make it to be hardened at 150 deg.C or more. When resin sealing is performed by this constitution, superior resistivity to high temperature and to high humidity can be obtained.
JP56051082A 1981-04-07 1981-04-07 Resin sealed semiconductor device Pending JPS57166054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56051082A JPS57166054A (en) 1981-04-07 1981-04-07 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56051082A JPS57166054A (en) 1981-04-07 1981-04-07 Resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS57166054A true JPS57166054A (en) 1982-10-13

Family

ID=12876887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56051082A Pending JPS57166054A (en) 1981-04-07 1981-04-07 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS57166054A (en)

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