JPS57157554A - Lead material with excellent heat resistance and conductivity for semiconductor device - Google Patents
Lead material with excellent heat resistance and conductivity for semiconductor deviceInfo
- Publication number
- JPS57157554A JPS57157554A JP56043404A JP4340481A JPS57157554A JP S57157554 A JPS57157554 A JP S57157554A JP 56043404 A JP56043404 A JP 56043404A JP 4340481 A JP4340481 A JP 4340481A JP S57157554 A JPS57157554 A JP S57157554A
- Authority
- JP
- Japan
- Prior art keywords
- lead material
- plate
- heat resistance
- produce
- excellent heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56043404A JPS57157554A (en) | 1981-03-25 | 1981-03-25 | Lead material with excellent heat resistance and conductivity for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56043404A JPS57157554A (en) | 1981-03-25 | 1981-03-25 | Lead material with excellent heat resistance and conductivity for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57157554A true JPS57157554A (en) | 1982-09-29 |
| JPS6218615B2 JPS6218615B2 (cs) | 1987-04-23 |
Family
ID=12662820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56043404A Granted JPS57157554A (en) | 1981-03-25 | 1981-03-25 | Lead material with excellent heat resistance and conductivity for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57157554A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5911659A (ja) * | 1982-07-12 | 1984-01-21 | Tamagawa Kikai Kinzoku Kk | 半導体用リ−ド材 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0175822U (cs) * | 1987-11-11 | 1989-05-23 |
-
1981
- 1981-03-25 JP JP56043404A patent/JPS57157554A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5911659A (ja) * | 1982-07-12 | 1984-01-21 | Tamagawa Kikai Kinzoku Kk | 半導体用リ−ド材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6218615B2 (cs) | 1987-04-23 |
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