JPS57148365A - Semiconductor device and manufacture thereof - Google Patents
Semiconductor device and manufacture thereofInfo
- Publication number
- JPS57148365A JPS57148365A JP3443481A JP3443481A JPS57148365A JP S57148365 A JPS57148365 A JP S57148365A JP 3443481 A JP3443481 A JP 3443481A JP 3443481 A JP3443481 A JP 3443481A JP S57148365 A JPS57148365 A JP S57148365A
- Authority
- JP
- Japan
- Prior art keywords
- type
- writing
- base
- layer
- high density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 230000015556 catabolic process Effects 0.000 abstract 2
- 238000000137 annealing Methods 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 238000005224 laser annealing Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/102—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
- H01L27/1022—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components including bipolar transistors
- H01L27/1026—Bipolar electrically programmable memory structures
Abstract
PURPOSE:To enable to simplify the performance of writing-in work of ROM utilizing voltage breakdown by a method wherein a thin insulating film is formed on the base region of a transistor, and a base electrode connecting structure is formed through the intermediary of an insulating film. CONSTITUTION:An N type collector section 2 is formed on a P type Si substrate 1, and thick Si oxide films 3a and 3a', thin Si oxide films 3b and 3b', a P type base section 4, P type high density graft bases 5a and 5b, and N type high density emitter sections 6a and 6b are formed. Then, the ion of an inert element is implanted using a photoresist film 8 s a mask, and an insulating layer 9 is formed. Then, the resist 8 is removed, and an insulating layer 9 is formed in the base 5b by performing an annealing or a laser annealing. Accordingly, the layer 9 can be used as a capacitor, and also when it is used as an ROM, its writing-in is performed by voltage breakdown of the layer 9, thereby enabling to perform a stabilized writing-in work.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3443481A JPS57148365A (en) | 1981-03-10 | 1981-03-10 | Semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3443481A JPS57148365A (en) | 1981-03-10 | 1981-03-10 | Semiconductor device and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57148365A true JPS57148365A (en) | 1982-09-13 |
Family
ID=12414109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3443481A Pending JPS57148365A (en) | 1981-03-10 | 1981-03-10 | Semiconductor device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57148365A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51121272A (en) * | 1975-04-17 | 1976-10-23 | Matsushita Electric Ind Co Ltd | Manufacturing method for semiconductor devices |
JPS53132281A (en) * | 1977-04-22 | 1978-11-17 | Nec Corp | Semiconductor memory device |
JPS5459090A (en) * | 1977-10-19 | 1979-05-12 | Nec Corp | Semiconductor device and its manufacture |
JPS54156490A (en) * | 1978-05-31 | 1979-12-10 | Toshiba Corp | Forming method of current path in semiconductor |
JPS5720466A (en) * | 1980-07-14 | 1982-02-02 | Toshiba Corp | Semiconductor memory device |
-
1981
- 1981-03-10 JP JP3443481A patent/JPS57148365A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51121272A (en) * | 1975-04-17 | 1976-10-23 | Matsushita Electric Ind Co Ltd | Manufacturing method for semiconductor devices |
JPS53132281A (en) * | 1977-04-22 | 1978-11-17 | Nec Corp | Semiconductor memory device |
JPS5459090A (en) * | 1977-10-19 | 1979-05-12 | Nec Corp | Semiconductor device and its manufacture |
JPS54156490A (en) * | 1978-05-31 | 1979-12-10 | Toshiba Corp | Forming method of current path in semiconductor |
JPS5720466A (en) * | 1980-07-14 | 1982-02-02 | Toshiba Corp | Semiconductor memory device |
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