JPS5714670A - Photosetting and pressure sensitive adhesive composition - Google Patents

Photosetting and pressure sensitive adhesive composition

Info

Publication number
JPS5714670A
JPS5714670A JP8960280A JP8960280A JPS5714670A JP S5714670 A JPS5714670 A JP S5714670A JP 8960280 A JP8960280 A JP 8960280A JP 8960280 A JP8960280 A JP 8960280A JP S5714670 A JPS5714670 A JP S5714670A
Authority
JP
Japan
Prior art keywords
molecular weight
monomer
composition
photosetting
low molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8960280A
Other languages
Japanese (ja)
Other versions
JPS5819709B2 (en
Inventor
Tomohisa Oota
Kiyoshi Nakao
Takeshi Nagaki
Nobuyuki Hayashi
Toshiaki Ishimaru
Yasuyuki Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP8960280A priority Critical patent/JPS5819709B2/en
Publication of JPS5714670A publication Critical patent/JPS5714670A/en
Publication of JPS5819709B2 publication Critical patent/JPS5819709B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: The titled composition, consisting of a solventless reaction product between a low molecular weight acrylic copolymer containing a specified amount of a specific tetrahydrofurfuryl acrylate monomer, etc. and a photopolymerizable monomer, and having improved adhesive force and cohesive force.
CONSTITUTION: (A) An acrylic copolymer, having a low molecular weight (a molecular weight of 1,000W50,000), and containing 5W40wt% tetrahydrofurfuryl (meth)acrylate monomer expressed by the formula (R is H or CH3) 2-ethylhexyl acrylate, etc. as another monomer) is reacted with (B) a photopolymerizable monomer, e.g. glycidyl methacrylate, capable of adding and reacting with the functional groups in the copolymer to give the aimed composition. Thd composition is cured rapidly by the irradiation with light, and preferably a photosensitizer, e.g. benzoin, in an amount of 0.1W10pts.wt. based on 100pts.wt. adhesive is used in the case of ultraviolet light.
COPYRIGHT: (C)1982,JPO&Japio
JP8960280A 1980-06-30 1980-06-30 Photocurable pressure-sensitive adhesive composition Expired JPS5819709B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8960280A JPS5819709B2 (en) 1980-06-30 1980-06-30 Photocurable pressure-sensitive adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8960280A JPS5819709B2 (en) 1980-06-30 1980-06-30 Photocurable pressure-sensitive adhesive composition

Publications (2)

Publication Number Publication Date
JPS5714670A true JPS5714670A (en) 1982-01-25
JPS5819709B2 JPS5819709B2 (en) 1983-04-19

Family

ID=13975304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8960280A Expired JPS5819709B2 (en) 1980-06-30 1980-06-30 Photocurable pressure-sensitive adhesive composition

Country Status (1)

Country Link
JP (1) JPS5819709B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100734996B1 (en) 2003-01-30 2007-07-03 신에쓰 가가꾸 고교 가부시끼가이샤 Polymer, Resist Composition and Patterning Process
JP2013230416A (en) * 2012-04-27 2013-11-14 Ricoh Co Ltd Particle dispersant, particle dispersion ink, and conductive pattern formation method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100734996B1 (en) 2003-01-30 2007-07-03 신에쓰 가가꾸 고교 가부시끼가이샤 Polymer, Resist Composition and Patterning Process
JP2013230416A (en) * 2012-04-27 2013-11-14 Ricoh Co Ltd Particle dispersant, particle dispersion ink, and conductive pattern formation method

Also Published As

Publication number Publication date
JPS5819709B2 (en) 1983-04-19

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