JPS57132445U - - Google Patents
Info
- Publication number
- JPS57132445U JPS57132445U JP1919881U JP1919881U JPS57132445U JP S57132445 U JPS57132445 U JP S57132445U JP 1919881 U JP1919881 U JP 1919881U JP 1919881 U JP1919881 U JP 1919881U JP S57132445 U JPS57132445 U JP S57132445U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981019198U JPH0222987Y2 (https=) | 1981-02-13 | 1981-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981019198U JPH0222987Y2 (https=) | 1981-02-13 | 1981-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57132445U true JPS57132445U (https=) | 1982-08-18 |
| JPH0222987Y2 JPH0222987Y2 (https=) | 1990-06-21 |
Family
ID=29817142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981019198U Expired JPH0222987Y2 (https=) | 1981-02-13 | 1981-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222987Y2 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53116082U (https=) * | 1977-02-24 | 1978-09-14 | ||
| JPS5512747A (en) * | 1978-07-12 | 1980-01-29 | Matsushita Electronics Corp | Lead frame detecting device |
| JPS5548140A (en) * | 1978-10-03 | 1980-04-05 | Oki Electric Ind Co Ltd | Double feed senser of paper |
| JPS55163856A (en) * | 1979-06-06 | 1980-12-20 | Toshiba Corp | Apparatus for positioning semiconductor device enclosure |
-
1981
- 1981-02-13 JP JP1981019198U patent/JPH0222987Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53116082U (https=) * | 1977-02-24 | 1978-09-14 | ||
| JPS5512747A (en) * | 1978-07-12 | 1980-01-29 | Matsushita Electronics Corp | Lead frame detecting device |
| JPS5548140A (en) * | 1978-10-03 | 1980-04-05 | Oki Electric Ind Co Ltd | Double feed senser of paper |
| JPS55163856A (en) * | 1979-06-06 | 1980-12-20 | Toshiba Corp | Apparatus for positioning semiconductor device enclosure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0222987Y2 (https=) | 1990-06-21 |