JPS57130453A - Thin film circuit device - Google Patents

Thin film circuit device

Info

Publication number
JPS57130453A
JPS57130453A JP1645581A JP1645581A JPS57130453A JP S57130453 A JPS57130453 A JP S57130453A JP 1645581 A JP1645581 A JP 1645581A JP 1645581 A JP1645581 A JP 1645581A JP S57130453 A JPS57130453 A JP S57130453A
Authority
JP
Japan
Prior art keywords
thin film
substrate
circuit
chip
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1645581A
Other languages
Japanese (ja)
Inventor
Masaaki Fuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1645581A priority Critical patent/JPS57130453A/en
Publication of JPS57130453A publication Critical patent/JPS57130453A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE:To enlarge the degree of freedom of design, to reduce the area of substrate and to manufacture a thin film circuit device at low cost and at high yield by a method wherein an active element of IC chip, etc., constituting the circuit is sealed airtightly on a pattern of thin film resistor element with a ceramic cap. CONSTITUTION:The thin film resistor 2, a thin film capacitor 3 and the IC chip 5 are connected by thin film conductors 4 to form the thin film circuit on an insulating substrate 1. At this circuit, the IC chip 5 is sealed airtightly with the ceramic cap 6 on the pattern of the thin film resistor 2. Trimming of the function of the passive elements of resistor, capacitor, etc., is made as to be performed after airtight sealing of the cap thereof is finished. Accordingly the degree of freedom of design is enlarged and the area of substrate can be reduced as compared with the method to seal the whole surface of substrate airtightly. Moreover the device can be manufactured at low cost and at high yield.
JP1645581A 1981-02-06 1981-02-06 Thin film circuit device Pending JPS57130453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1645581A JPS57130453A (en) 1981-02-06 1981-02-06 Thin film circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1645581A JPS57130453A (en) 1981-02-06 1981-02-06 Thin film circuit device

Publications (1)

Publication Number Publication Date
JPS57130453A true JPS57130453A (en) 1982-08-12

Family

ID=11916720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1645581A Pending JPS57130453A (en) 1981-02-06 1981-02-06 Thin film circuit device

Country Status (1)

Country Link
JP (1) JPS57130453A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996006459A1 (en) * 1994-08-25 1996-02-29 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459249Y1 (en) * 1966-10-29 1970-04-30
JPS5413966A (en) * 1977-07-01 1979-02-01 Nippon Electric Co Substrate for multiilayer wiring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459249Y1 (en) * 1966-10-29 1970-04-30
JPS5413966A (en) * 1977-07-01 1979-02-01 Nippon Electric Co Substrate for multiilayer wiring

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996006459A1 (en) * 1994-08-25 1996-02-29 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
US5629563A (en) * 1994-08-25 1997-05-13 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages

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