JPS57128076A - Manufacture of schottky barrier diode - Google Patents
Manufacture of schottky barrier diodeInfo
- Publication number
- JPS57128076A JPS57128076A JP1274281A JP1274281A JPS57128076A JP S57128076 A JPS57128076 A JP S57128076A JP 1274281 A JP1274281 A JP 1274281A JP 1274281 A JP1274281 A JP 1274281A JP S57128076 A JPS57128076 A JP S57128076A
- Authority
- JP
- Japan
- Prior art keywords
- film
- aperture
- schottky barrier
- substrate
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004888 barrier function Effects 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 229910021332 silicide Inorganic materials 0.000 abstract 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2257—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer being silicon or silicide or SIPOS, e.g. polysilicon, porous silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To contrive the improvement of integration as well as to simplify the manufacture of the subject Schottky barrier diode by a method wherein a guard ring section is formed by preforming a self-slignment for a Schottky barrier section. CONSTITUTION:A thermal oxidizing treatment is performed on an N type silicon substrate 11, a thermal oxide film 12 is formed on the surface of the substrate 11, and a silicon nitride film 13 having a selective etching property is formed on the film 12. Then, an aperture 14 is formed by performing a selective etching on the film 13, and then using the film 13 as an mask, a aperture 16 is formed by overetching the film 12 utilizing an overhang 15. Besides, a boron-added crystal silicon film 17 having the second conductive impurities is deposited on the film 13 including the aperture 16, and then an etching is perormed on the film 17 in such a manner that the film 17 will remain at the lower part of the overhang 15. Subsequently, boron is deffused on the substrate 11 from the film 17', and after a P<+> type guard ring section 18 has been formed for the aperture section 16 by performing a self-alignment, a silicide layer 19 is formed on the remaining surface of the film 17' by performing heat treatment, and the an Al wiring 20 is formed.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1274281A JPS57128076A (en) | 1981-01-30 | 1981-01-30 | Manufacture of schottky barrier diode |
US06/341,588 US4414737A (en) | 1981-01-30 | 1982-01-21 | Production of Schottky barrier diode |
DE19823202608 DE3202608A1 (en) | 1981-01-30 | 1982-01-27 | METHOD FOR PRODUCING A SCHOTTKY BARRIER DIODE AND THEREFORE BARRIER DIODE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1274281A JPS57128076A (en) | 1981-01-30 | 1981-01-30 | Manufacture of schottky barrier diode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57128076A true JPS57128076A (en) | 1982-08-09 |
Family
ID=11813871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1274281A Pending JPS57128076A (en) | 1981-01-30 | 1981-01-30 | Manufacture of schottky barrier diode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57128076A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5696025A (en) * | 1996-02-02 | 1997-12-09 | Micron Technology, Inc. | Method of forming guard ringed schottky diode |
-
1981
- 1981-01-30 JP JP1274281A patent/JPS57128076A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5696025A (en) * | 1996-02-02 | 1997-12-09 | Micron Technology, Inc. | Method of forming guard ringed schottky diode |
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