JPS5712531B2 - - Google Patents
Info
- Publication number
- JPS5712531B2 JPS5712531B2 JP13106076A JP13106076A JPS5712531B2 JP S5712531 B2 JPS5712531 B2 JP S5712531B2 JP 13106076 A JP13106076 A JP 13106076A JP 13106076 A JP13106076 A JP 13106076A JP S5712531 B2 JPS5712531 B2 JP S5712531B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13106076A JPS5355967A (en) | 1976-10-30 | 1976-10-30 | Method of coneirming position for feeding lead frames |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13106076A JPS5355967A (en) | 1976-10-30 | 1976-10-30 | Method of coneirming position for feeding lead frames |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5355967A JPS5355967A (en) | 1978-05-20 |
JPS5712531B2 true JPS5712531B2 (US08063081-20111122-C00044.png) | 1982-03-11 |
Family
ID=15049057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13106076A Granted JPS5355967A (en) | 1976-10-30 | 1976-10-30 | Method of coneirming position for feeding lead frames |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5355967A (US08063081-20111122-C00044.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0113961Y2 (US08063081-20111122-C00044.png) * | 1983-04-28 | 1989-04-24 |
-
1976
- 1976-10-30 JP JP13106076A patent/JPS5355967A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0113961Y2 (US08063081-20111122-C00044.png) * | 1983-04-28 | 1989-04-24 |
Also Published As
Publication number | Publication date |
---|---|
JPS5355967A (en) | 1978-05-20 |