JPS57124454A - Sealing method for ceramic case - Google Patents

Sealing method for ceramic case

Info

Publication number
JPS57124454A
JPS57124454A JP56010008A JP1000881A JPS57124454A JP S57124454 A JPS57124454 A JP S57124454A JP 56010008 A JP56010008 A JP 56010008A JP 1000881 A JP1000881 A JP 1000881A JP S57124454 A JPS57124454 A JP S57124454A
Authority
JP
Japan
Prior art keywords
temperatures
lid
sealing
service
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56010008A
Other languages
Japanese (ja)
Inventor
Masanobu Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56010008A priority Critical patent/JPS57124454A/en
Publication of JPS57124454A publication Critical patent/JPS57124454A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE:To reduce manufacturing cost by omitting special sealing materials and sealing equipment by a method wherein a sealing lid made of a shape remembering alloy with its size subject to environmental temperatures realizes a secure sealing. CONSTITUTION:A sealing lid 2 for a ceramic case is made of an alloy remembering its original shape at service temperature even when exposed to temperatures sufficiently higher or lower than said service temperatures. The ceramic case has an opening that accommodates the lid and the lid is made with its area slightly larger than the opening at service temperatures so that the lid can be easily installed at lower or higher temperatures with its area shrunk. The lid settles itself tight in the opening as temperatures are back to service temperatures.
JP56010008A 1981-01-26 1981-01-26 Sealing method for ceramic case Pending JPS57124454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56010008A JPS57124454A (en) 1981-01-26 1981-01-26 Sealing method for ceramic case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56010008A JPS57124454A (en) 1981-01-26 1981-01-26 Sealing method for ceramic case

Publications (1)

Publication Number Publication Date
JPS57124454A true JPS57124454A (en) 1982-08-03

Family

ID=11738367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56010008A Pending JPS57124454A (en) 1981-01-26 1981-01-26 Sealing method for ceramic case

Country Status (1)

Country Link
JP (1) JPS57124454A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
JP2007055430A (en) * 2005-08-24 2007-03-08 Denso Corp Display device for vehicle
CN106695044A (en) * 2017-01-20 2017-05-24 西南电子技术研究所（中国电子科技集团公司第十研究所） Interface hermetic packaging method for electronic circuit module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
JP2007055430A (en) * 2005-08-24 2007-03-08 Denso Corp Display device for vehicle
CN106695044A (en) * 2017-01-20 2017-05-24 西南电子技术研究所（中国电子科技集团公司第十研究所） Interface hermetic packaging method for electronic circuit module

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