JPS57119969A - Hot-melt polyester adhesive composition - Google Patents

Hot-melt polyester adhesive composition

Info

Publication number
JPS57119969A
JPS57119969A JP471481A JP471481A JPS57119969A JP S57119969 A JPS57119969 A JP S57119969A JP 471481 A JP471481 A JP 471481A JP 471481 A JP471481 A JP 471481A JP S57119969 A JPS57119969 A JP S57119969A
Authority
JP
Japan
Prior art keywords
acid
adhesive composition
hot
prepd
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP471481A
Other languages
Japanese (ja)
Inventor
Kiminori Yogo
Shunji Kamiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Priority to JP471481A priority Critical patent/JPS57119969A/en
Publication of JPS57119969A publication Critical patent/JPS57119969A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The titled adhesive composition capable of firmly bonding an adherend without preheating, prepd. by compounding a copolymerized polyester with an epoxy resin in a predetermined proportion.
CONSTITUTION: 95W40wt% copolymerized polyester prepd. by the copolymn. of at least two kinds of acids selected from terephthalic acid, isophthalic acid and 4W20C aliph. dicarboxylic acids, e.g., a mixture of terephthalic acid, isophthalic acid, adipic acid, succinic acid and glutaric acid, with an alkylene glycol such as ethylene glycol or 1,4-butanediol, and 5W60wt% epoxy resin such as a bisphenol A/epichlorohydrin adduct of softening temp. about 50W150°C, are mixed by use of a kneader, mixing roll, etc., to prepare an adhesive composition.
COPYRIGHT: (C)1982,JPO&Japio
JP471481A 1981-01-16 1981-01-16 Hot-melt polyester adhesive composition Pending JPS57119969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP471481A JPS57119969A (en) 1981-01-16 1981-01-16 Hot-melt polyester adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP471481A JPS57119969A (en) 1981-01-16 1981-01-16 Hot-melt polyester adhesive composition

Publications (1)

Publication Number Publication Date
JPS57119969A true JPS57119969A (en) 1982-07-26

Family

ID=11591546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP471481A Pending JPS57119969A (en) 1981-01-16 1981-01-16 Hot-melt polyester adhesive composition

Country Status (1)

Country Link
JP (1) JPS57119969A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266483A (en) * 1985-05-20 1986-11-26 Toagosei Chem Ind Co Ltd Adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266483A (en) * 1985-05-20 1986-11-26 Toagosei Chem Ind Co Ltd Adhesive composition
JPH039952B2 (en) * 1985-05-20 1991-02-12 Toa Gosei Chem Ind

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