JPS5649271A - Phenol resin laminated board - Google Patents
Phenol resin laminated boardInfo
- Publication number
- JPS5649271A JPS5649271A JP12580879A JP12580879A JPS5649271A JP S5649271 A JPS5649271 A JP S5649271A JP 12580879 A JP12580879 A JP 12580879A JP 12580879 A JP12580879 A JP 12580879A JP S5649271 A JPS5649271 A JP S5649271A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- laminated board
- resin laminated
- board
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12580879A JPS5649271A (en) | 1979-09-28 | 1979-09-28 | Phenol resin laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12580879A JPS5649271A (en) | 1979-09-28 | 1979-09-28 | Phenol resin laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5649271A true JPS5649271A (en) | 1981-05-02 |
Family
ID=14919419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12580879A Pending JPS5649271A (en) | 1979-09-28 | 1979-09-28 | Phenol resin laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5649271A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6207595B1 (en) | 1998-03-02 | 2001-03-27 | International Business Machines Corporation | Laminate and method of manufacture thereof |
US7078816B2 (en) | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
US7145221B2 (en) | 2004-03-31 | 2006-12-05 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
US7270845B2 (en) | 2004-03-31 | 2007-09-18 | Endicott Interconnect Technologies, Inc. | Dielectric composition for forming dielectric layer for use in circuitized substrates |
-
1979
- 1979-09-28 JP JP12580879A patent/JPS5649271A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6207595B1 (en) | 1998-03-02 | 2001-03-27 | International Business Machines Corporation | Laminate and method of manufacture thereof |
US7078816B2 (en) | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
US7145221B2 (en) | 2004-03-31 | 2006-12-05 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
US7270845B2 (en) | 2004-03-31 | 2007-09-18 | Endicott Interconnect Technologies, Inc. | Dielectric composition for forming dielectric layer for use in circuitized substrates |
US7416996B2 (en) | 2004-03-31 | 2008-08-26 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrate |
US7508076B2 (en) | 2004-03-31 | 2009-03-24 | Endicott Interconnect Technologies, Inc. | Information handling system including a circuitized substrate having a dielectric layer without continuous fibers |
US8445094B2 (en) | 2004-03-31 | 2013-05-21 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2051840B (en) | Phenolic resin | |
JPS5563255A (en) | Phenol resin foam laminated board | |
JPS5649271A (en) | Phenol resin laminated board | |
JPS55126450A (en) | Resin laminate | |
JPS5682242A (en) | Laminated board | |
JPS5695605A (en) | Woody laminated board | |
JPS5610464A (en) | Manufacture of phenol resin laminated board | |
JPS5732950A (en) | Synthetic resin laminated board | |
JPS5680452A (en) | Heattproof wearrproof laminated board | |
JPS55126445A (en) | Laminated board | |
JPS5649265A (en) | Laminated board | |
JPS56156A (en) | Copper lined phenol resin laminated board | |
JPS56162643A (en) | Synthetic resin laminated board | |
JPS56162A (en) | Phenol resin laminated board | |
JPS5615351A (en) | Manufacture of phenol resin laminated board for resistor | |
JPS5690589A (en) | Copperrcoated laminated board | |
JPS55135662A (en) | Laminated board | |
JPS5664868A (en) | Manufacture of phenol resin laminated board | |
JPS5689554A (en) | Lowwtemperature punchinggpossible phenol laminated board | |
JPS5696896A (en) | Adhesive for copperrcoated laminated board | |
JPS57109636A (en) | Laminated board | |
JPS5774149A (en) | Laminated board | |
JPS56164847A (en) | Synthetic resin laminated board | |
JPS56148553A (en) | Synthetic resin laminated board | |
JPS5664867A (en) | Manufacture of phenol resin laminated board |