JPS5649271A - Phenol resin laminated board - Google Patents

Phenol resin laminated board

Info

Publication number
JPS5649271A
JPS5649271A JP12580879A JP12580879A JPS5649271A JP S5649271 A JPS5649271 A JP S5649271A JP 12580879 A JP12580879 A JP 12580879A JP 12580879 A JP12580879 A JP 12580879A JP S5649271 A JPS5649271 A JP S5649271A
Authority
JP
Japan
Prior art keywords
phenol resin
laminated board
resin laminated
board
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12580879A
Other languages
Japanese (ja)
Inventor
Yoshikazu Nishikawa
Seishichi Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12580879A priority Critical patent/JPS5649271A/en
Publication of JPS5649271A publication Critical patent/JPS5649271A/en
Pending legal-status Critical Current

Links

JP12580879A 1979-09-28 1979-09-28 Phenol resin laminated board Pending JPS5649271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12580879A JPS5649271A (en) 1979-09-28 1979-09-28 Phenol resin laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12580879A JPS5649271A (en) 1979-09-28 1979-09-28 Phenol resin laminated board

Publications (1)

Publication Number Publication Date
JPS5649271A true JPS5649271A (en) 1981-05-02

Family

ID=14919419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12580879A Pending JPS5649271A (en) 1979-09-28 1979-09-28 Phenol resin laminated board

Country Status (1)

Country Link
JP (1) JPS5649271A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207595B1 (en) 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
US7078816B2 (en) 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7145221B2 (en) 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7270845B2 (en) 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207595B1 (en) 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
US7078816B2 (en) 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7145221B2 (en) 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7270845B2 (en) 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7416996B2 (en) 2004-03-31 2008-08-26 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate
US7508076B2 (en) 2004-03-31 2009-03-24 Endicott Interconnect Technologies, Inc. Information handling system including a circuitized substrate having a dielectric layer without continuous fibers
US8445094B2 (en) 2004-03-31 2013-05-21 Endicott Interconnect Technologies, Inc. Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers

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