JPS5645064A - Under coating film structure of thin film hybrid circuit - Google Patents

Under coating film structure of thin film hybrid circuit

Info

Publication number
JPS5645064A
JPS5645064A JP12066879A JP12066879A JPS5645064A JP S5645064 A JPS5645064 A JP S5645064A JP 12066879 A JP12066879 A JP 12066879A JP 12066879 A JP12066879 A JP 12066879A JP S5645064 A JPS5645064 A JP S5645064A
Authority
JP
Japan
Prior art keywords
film
layer
under coating
exposure
photoetching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12066879A
Other languages
Japanese (ja)
Inventor
Eiji Matsuzaki
Michiyoshi Kawahito
Takehisa Komatsu
Tsuneaki Kamei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12066879A priority Critical patent/JPS5645064A/en
Publication of JPS5645064A publication Critical patent/JPS5645064A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

PURPOSE:To permit a fine process by providing a Cr layer between a Ta thermal oxide film and a glazed layer wherein the internal exposure of a resist film causing during a photoetching process is prevented. CONSTITUTION:An under coating Ta2O3 film 23 is stacked on a glazed layer 9 containing comparatively much PbO formed on a thin plate hybrid circuit substrate 10 through a Cr layer 16. The Cr has strong adhesion with glass or alumina and will form a film having big internal deformation without exfoliation. Furthermore, the Cr reflects the light of the wave length region of photoetching exposure. Therefore, excessive exposure will be prevented. With photoetching applied by using an under coating film composing of the above structure, the inside of an upper layer resist film will not be exposed by diffused reflection and by the exfoliation between the under coating film 23 and the glazed layer. Therefore, a fine process will be permitted and exposure hours will also be reduced.
JP12066879A 1979-09-21 1979-09-21 Under coating film structure of thin film hybrid circuit Pending JPS5645064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12066879A JPS5645064A (en) 1979-09-21 1979-09-21 Under coating film structure of thin film hybrid circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12066879A JPS5645064A (en) 1979-09-21 1979-09-21 Under coating film structure of thin film hybrid circuit

Publications (1)

Publication Number Publication Date
JPS5645064A true JPS5645064A (en) 1981-04-24

Family

ID=14791952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12066879A Pending JPS5645064A (en) 1979-09-21 1979-09-21 Under coating film structure of thin film hybrid circuit

Country Status (1)

Country Link
JP (1) JPS5645064A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0191852U (en) * 1987-12-07 1989-06-16

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0191852U (en) * 1987-12-07 1989-06-16
JPH0548031Y2 (en) * 1987-12-07 1993-12-20

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