JPS5638852A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5638852A JPS5638852A JP11501879A JP11501879A JPS5638852A JP S5638852 A JPS5638852 A JP S5638852A JP 11501879 A JP11501879 A JP 11501879A JP 11501879 A JP11501879 A JP 11501879A JP S5638852 A JPS5638852 A JP S5638852A
- Authority
- JP
- Japan
- Prior art keywords
- distance
- misfet
- signal path
- semiconductor region
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Abstract
PURPOSE:To prevent the breakdown of the signal path, by setting the distance between the semiconductor region for the signal path and the high-density semiconductor region formed on a semiconductor substrate, so that the distance on the side of an external imput terminal is longer than the distance on the side of inner wirings. CONSTITUTION:On a semiconductor substrate F, are provided a semiconductor layer E for a signal path for connecting an MISFET (not shown in the Figure) and an external input terminal IN and a high-density semiconductor layer G, with the distance being provided from the layer E to protect the MISFET from the eternal excessive input. The distance between the layers E and G is provided in such a way that the distance Lr on the side of the internal input terminal IN is longer than the distance Lp on the MISFET side. It is desirable to set the separating distance so that it is proportional to the potential drop in the semiconductor region F and that the field strength between both layers at any place becomes uniform.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11501879A JPS5638852A (en) | 1979-09-07 | 1979-09-07 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11501879A JPS5638852A (en) | 1979-09-07 | 1979-09-07 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5638852A true JPS5638852A (en) | 1981-04-14 |
Family
ID=14652203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11501879A Pending JPS5638852A (en) | 1979-09-07 | 1979-09-07 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5638852A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5992557A (en) * | 1982-11-18 | 1984-05-28 | Nec Corp | Semiconductor integrated circuit with input protection circuit |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5414172A (en) * | 1977-07-04 | 1979-02-02 | Seiko Epson Corp | Semiconductor device |
-
1979
- 1979-09-07 JP JP11501879A patent/JPS5638852A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5414172A (en) * | 1977-07-04 | 1979-02-02 | Seiko Epson Corp | Semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5992557A (en) * | 1982-11-18 | 1984-05-28 | Nec Corp | Semiconductor integrated circuit with input protection circuit |
JPH0334659B2 (en) * | 1982-11-18 | 1991-05-23 | Nippon Electric Co |
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