JPS5623762A - Epoxy resin composition for sealing semiconductor - Google Patents

Epoxy resin composition for sealing semiconductor

Info

Publication number
JPS5623762A
JPS5623762A JP9838079A JP9838079A JPS5623762A JP S5623762 A JPS5623762 A JP S5623762A JP 9838079 A JP9838079 A JP 9838079A JP 9838079 A JP9838079 A JP 9838079A JP S5623762 A JPS5623762 A JP S5623762A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
approx
silica powder
acetic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9838079A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5750063B2 (https=
Inventor
Takahiro Yoshioka
Hideto Suzuki
Shunichi Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP9838079A priority Critical patent/JPS5623762A/ja
Priority to US06/127,719 priority patent/US4271061A/en
Publication of JPS5623762A publication Critical patent/JPS5623762A/ja
Publication of JPS5750063B2 publication Critical patent/JPS5750063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP9838079A 1979-03-06 1979-07-31 Epoxy resin composition for sealing semiconductor Granted JPS5623762A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9838079A JPS5623762A (en) 1979-07-31 1979-07-31 Epoxy resin composition for sealing semiconductor
US06/127,719 US4271061A (en) 1979-03-06 1980-03-06 Epoxy resin compositions for sealing semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9838079A JPS5623762A (en) 1979-07-31 1979-07-31 Epoxy resin composition for sealing semiconductor

Publications (2)

Publication Number Publication Date
JPS5623762A true JPS5623762A (en) 1981-03-06
JPS5750063B2 JPS5750063B2 (https=) 1982-10-25

Family

ID=14218259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9838079A Granted JPS5623762A (en) 1979-03-06 1979-07-31 Epoxy resin composition for sealing semiconductor

Country Status (1)

Country Link
JP (1) JPS5623762A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278522A (ja) * 1988-04-28 1989-11-08 Somar Corp 含浸に好適なエポキシ樹脂組成物
JP2023530026A (ja) * 2020-06-22 2023-07-12 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 光硬化性組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124558U (https=) * 1986-01-30 1987-08-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278522A (ja) * 1988-04-28 1989-11-08 Somar Corp 含浸に好適なエポキシ樹脂組成物
JP2023530026A (ja) * 2020-06-22 2023-07-12 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 光硬化性組成物

Also Published As

Publication number Publication date
JPS5750063B2 (https=) 1982-10-25

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