JPS56159037U - - Google Patents
Info
- Publication number
- JPS56159037U JPS56159037U JP5792180U JP5792180U JPS56159037U JP S56159037 U JPS56159037 U JP S56159037U JP 5792180 U JP5792180 U JP 5792180U JP 5792180 U JP5792180 U JP 5792180U JP S56159037 U JPS56159037 U JP S56159037U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980057921U JPS5745959Y2 (US20030199744A1-20031023-C00003.png) | 1980-04-25 | 1980-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980057921U JPS5745959Y2 (US20030199744A1-20031023-C00003.png) | 1980-04-25 | 1980-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56159037U true JPS56159037U (US20030199744A1-20031023-C00003.png) | 1981-11-27 |
| JPS5745959Y2 JPS5745959Y2 (US20030199744A1-20031023-C00003.png) | 1982-10-09 |
Family
ID=29652404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980057921U Expired JPS5745959Y2 (US20030199744A1-20031023-C00003.png) | 1980-04-25 | 1980-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5745959Y2 (US20030199744A1-20031023-C00003.png) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7042068B2 (en) | 2000-04-27 | 2006-05-09 | Amkor Technology, Inc. | Leadframe and semiconductor package made using the leadframe |
| US6905914B1 (en) | 2002-11-08 | 2005-06-14 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8324511B1 (en) | 2010-04-06 | 2012-12-04 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US8440554B1 (en) | 2010-08-02 | 2013-05-14 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US8487445B1 (en) | 2010-10-05 | 2013-07-16 | Amkor Technology, Inc. | Semiconductor device having through electrodes protruding from dielectric layer |
| US8552548B1 (en) | 2011-11-29 | 2013-10-08 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636448U (US20030199744A1-20031023-C00003.png) * | 1979-08-29 | 1981-04-08 |
-
1980
- 1980-04-25 JP JP1980057921U patent/JPS5745959Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636448U (US20030199744A1-20031023-C00003.png) * | 1979-08-29 | 1981-04-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5745959Y2 (US20030199744A1-20031023-C00003.png) | 1982-10-09 |
