JPS5614069A - Soldering method and soldering material - Google Patents
Soldering method and soldering materialInfo
- Publication number
- JPS5614069A JPS5614069A JP9020579A JP9020579A JPS5614069A JP S5614069 A JPS5614069 A JP S5614069A JP 9020579 A JP9020579 A JP 9020579A JP 9020579 A JP9020579 A JP 9020579A JP S5614069 A JPS5614069 A JP S5614069A
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- soldering
- materials
- soldering material
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9020579A JPS5614069A (en) | 1979-07-16 | 1979-07-16 | Soldering method and soldering material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9020579A JPS5614069A (en) | 1979-07-16 | 1979-07-16 | Soldering method and soldering material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5614069A true JPS5614069A (en) | 1981-02-10 |
Family
ID=13991979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9020579A Pending JPS5614069A (en) | 1979-07-16 | 1979-07-16 | Soldering method and soldering material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5614069A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4819857A (en) * | 1986-10-17 | 1989-04-11 | Hitachi, Ltd. | Method for fabricating composite structure |
US5317191A (en) * | 1991-08-19 | 1994-05-31 | Mitsubishi Denki Kabushiki Kaisha | Low-melting-point junction material having high-melting-point particles uniformly dispersed therein |
US5377899A (en) * | 1993-01-29 | 1995-01-03 | Nec Corporation | Method for producing solder that contains therein additive particles maintaining its shape |
WO1997035683A1 (de) * | 1996-03-22 | 1997-10-02 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Gelöteter metallischer wabenkörper mit abstandshaltern in den lötspalten und verfahren und lot zu seiner herstellung |
CN103426780A (zh) * | 2012-05-14 | 2013-12-04 | 万国半导体(开曼)股份有限公司 | 焊球阵列用作高度垫块及焊料固定物 |
JP2014018832A (ja) * | 2012-07-18 | 2014-02-03 | Nippon Handa Kk | 金属線入り成形はんだ及びその製造方法 |
-
1979
- 1979-07-16 JP JP9020579A patent/JPS5614069A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4819857A (en) * | 1986-10-17 | 1989-04-11 | Hitachi, Ltd. | Method for fabricating composite structure |
US5317191A (en) * | 1991-08-19 | 1994-05-31 | Mitsubishi Denki Kabushiki Kaisha | Low-melting-point junction material having high-melting-point particles uniformly dispersed therein |
US5377899A (en) * | 1993-01-29 | 1995-01-03 | Nec Corporation | Method for producing solder that contains therein additive particles maintaining its shape |
WO1997035683A1 (de) * | 1996-03-22 | 1997-10-02 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Gelöteter metallischer wabenkörper mit abstandshaltern in den lötspalten und verfahren und lot zu seiner herstellung |
JP2000507160A (ja) * | 1996-03-22 | 2000-06-13 | エミテツク ゲゼルシヤフト フユア エミツシオンステクノロギー ミツト ベシユレンクテル ハフツング | ろう付け隙間内にスペーサを備えたろう付け金属ハニカム体とそのろう付け方法とそれに利用するろう |
CN103426780A (zh) * | 2012-05-14 | 2013-12-04 | 万国半导体(开曼)股份有限公司 | 焊球阵列用作高度垫块及焊料固定物 |
JP2014018832A (ja) * | 2012-07-18 | 2014-02-03 | Nippon Handa Kk | 金属線入り成形はんだ及びその製造方法 |
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