JPS5614069A - Soldering method and soldering material - Google Patents

Soldering method and soldering material

Info

Publication number
JPS5614069A
JPS5614069A JP9020579A JP9020579A JPS5614069A JP S5614069 A JPS5614069 A JP S5614069A JP 9020579 A JP9020579 A JP 9020579A JP 9020579 A JP9020579 A JP 9020579A JP S5614069 A JPS5614069 A JP S5614069A
Authority
JP
Japan
Prior art keywords
thickness
soldering
materials
soldering material
predetermined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9020579A
Other languages
English (en)
Inventor
Yukiyasu Usunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9020579A priority Critical patent/JPS5614069A/ja
Publication of JPS5614069A publication Critical patent/JPS5614069A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP9020579A 1979-07-16 1979-07-16 Soldering method and soldering material Pending JPS5614069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9020579A JPS5614069A (en) 1979-07-16 1979-07-16 Soldering method and soldering material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9020579A JPS5614069A (en) 1979-07-16 1979-07-16 Soldering method and soldering material

Publications (1)

Publication Number Publication Date
JPS5614069A true JPS5614069A (en) 1981-02-10

Family

ID=13991979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9020579A Pending JPS5614069A (en) 1979-07-16 1979-07-16 Soldering method and soldering material

Country Status (1)

Country Link
JP (1) JPS5614069A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819857A (en) * 1986-10-17 1989-04-11 Hitachi, Ltd. Method for fabricating composite structure
US5317191A (en) * 1991-08-19 1994-05-31 Mitsubishi Denki Kabushiki Kaisha Low-melting-point junction material having high-melting-point particles uniformly dispersed therein
US5377899A (en) * 1993-01-29 1995-01-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
WO1997035683A1 (de) * 1996-03-22 1997-10-02 Emitec Gesellschaft Für Emissionstechnologie Mbh Gelöteter metallischer wabenkörper mit abstandshaltern in den lötspalten und verfahren und lot zu seiner herstellung
CN103426780A (zh) * 2012-05-14 2013-12-04 万国半导体(开曼)股份有限公司 焊球阵列用作高度垫块及焊料固定物
JP2014018832A (ja) * 2012-07-18 2014-02-03 Nippon Handa Kk 金属線入り成形はんだ及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819857A (en) * 1986-10-17 1989-04-11 Hitachi, Ltd. Method for fabricating composite structure
US5317191A (en) * 1991-08-19 1994-05-31 Mitsubishi Denki Kabushiki Kaisha Low-melting-point junction material having high-melting-point particles uniformly dispersed therein
US5377899A (en) * 1993-01-29 1995-01-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
WO1997035683A1 (de) * 1996-03-22 1997-10-02 Emitec Gesellschaft Für Emissionstechnologie Mbh Gelöteter metallischer wabenkörper mit abstandshaltern in den lötspalten und verfahren und lot zu seiner herstellung
JP2000507160A (ja) * 1996-03-22 2000-06-13 エミテツク ゲゼルシヤフト フユア エミツシオンステクノロギー ミツト ベシユレンクテル ハフツング ろう付け隙間内にスペーサを備えたろう付け金属ハニカム体とそのろう付け方法とそれに利用するろう
CN103426780A (zh) * 2012-05-14 2013-12-04 万国半导体(开曼)股份有限公司 焊球阵列用作高度垫块及焊料固定物
JP2014018832A (ja) * 2012-07-18 2014-02-03 Nippon Handa Kk 金属線入り成形はんだ及びその製造方法

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