JPS5591995A - Forming method of gold layer - Google Patents

Forming method of gold layer

Info

Publication number
JPS5591995A
JPS5591995A JP16301878A JP16301878A JPS5591995A JP S5591995 A JPS5591995 A JP S5591995A JP 16301878 A JP16301878 A JP 16301878A JP 16301878 A JP16301878 A JP 16301878A JP S5591995 A JPS5591995 A JP S5591995A
Authority
JP
Japan
Prior art keywords
layer
gold
gold layer
primary
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16301878A
Other languages
Japanese (ja)
Inventor
Masao Nishiyama
Junichi Okada
Kiyoetsu Fukui
Shigeo Ando
Yukio Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, NEC Corp filed Critical NEC Home Electronics Ltd
Priority to JP16301878A priority Critical patent/JPS5591995A/en
Publication of JPS5591995A publication Critical patent/JPS5591995A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make the gold layer formed superior in corrosion resistance by forming a primary gold layer on the object article, firmly bonding the same through heating by way of a sinter layer then applying a secondary gold layer. CONSTITUTION:A primary gold plating layer 10 of thicknesses 0.5-1.5mu is formed to the surface of the object article composed of a metal outer ring 1 and lead wires 6, 7, 8. Thence, it is heated for 3-10min. at 300-450 deg.C in a neutral atmosphere and this causes part of the primary gold plating layer to enter the crystal grains of the metal outer ring 1 and lead wires 6, 7, 8, thereby forming a sinter layer 11 and resulting in increased adhesion force and disappearance of pinholes, etc. Thence, a secondary gold plating layer 12 of thicknesses 1-5mu is formed on the primary gold layer 10 to make the total tickness of the plating layer specified 1.27-5.08mu. By this method, the gold layer of superior corrosion resistance is formed.
JP16301878A 1978-12-28 1978-12-28 Forming method of gold layer Pending JPS5591995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16301878A JPS5591995A (en) 1978-12-28 1978-12-28 Forming method of gold layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16301878A JPS5591995A (en) 1978-12-28 1978-12-28 Forming method of gold layer

Publications (1)

Publication Number Publication Date
JPS5591995A true JPS5591995A (en) 1980-07-11

Family

ID=15765620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16301878A Pending JPS5591995A (en) 1978-12-28 1978-12-28 Forming method of gold layer

Country Status (1)

Country Link
JP (1) JPS5591995A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4693939A (en) * 1983-06-03 1987-09-15 Minnesota Mining And Manufacturing Company Article coated with copolymer of poly(vinyl alcohol)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4693939A (en) * 1983-06-03 1987-09-15 Minnesota Mining And Manufacturing Company Article coated with copolymer of poly(vinyl alcohol)

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