JPS5575230A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5575230A
JPS5575230A JP15035178A JP15035178A JPS5575230A JP S5575230 A JPS5575230 A JP S5575230A JP 15035178 A JP15035178 A JP 15035178A JP 15035178 A JP15035178 A JP 15035178A JP S5575230 A JPS5575230 A JP S5575230A
Authority
JP
Japan
Prior art keywords
insulator
gate
conductive wire
hole
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15035178A
Other languages
English (en)
Inventor
Mitsuo Odate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15035178A priority Critical patent/JPS5575230A/ja
Publication of JPS5575230A publication Critical patent/JPS5575230A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP15035178A 1978-12-04 1978-12-04 Semiconductor device Pending JPS5575230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15035178A JPS5575230A (en) 1978-12-04 1978-12-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15035178A JPS5575230A (en) 1978-12-04 1978-12-04 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5575230A true JPS5575230A (en) 1980-06-06

Family

ID=15495084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15035178A Pending JPS5575230A (en) 1978-12-04 1978-12-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5575230A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102738100A (zh) * 2012-06-14 2012-10-17 无锡天杨电子有限公司 用于串接式晶闸管的阳极管座

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102738100A (zh) * 2012-06-14 2012-10-17 无锡天杨电子有限公司 用于串接式晶闸管的阳极管座

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