JPS555856B2 - - Google Patents

Info

Publication number
JPS555856B2
JPS555856B2 JP7601775A JP7601775A JPS555856B2 JP S555856 B2 JPS555856 B2 JP S555856B2 JP 7601775 A JP7601775 A JP 7601775A JP 7601775 A JP7601775 A JP 7601775A JP S555856 B2 JPS555856 B2 JP S555856B2
Authority
JP
Japan
Prior art keywords
high efficiency
uniform thickness
predetermined spot
efficiency automatic
automatic applicator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7601775A
Other languages
English (en)
Japanese (ja)
Other versions
JPS51151736A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7601775A priority Critical patent/JPS51151736A/ja
Publication of JPS51151736A publication Critical patent/JPS51151736A/ja
Publication of JPS555856B2 publication Critical patent/JPS555856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7601775A 1975-06-21 1975-06-21 Automatic applicator of adhesives Granted JPS51151736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7601775A JPS51151736A (en) 1975-06-21 1975-06-21 Automatic applicator of adhesives

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7601775A JPS51151736A (en) 1975-06-21 1975-06-21 Automatic applicator of adhesives

Publications (2)

Publication Number Publication Date
JPS51151736A JPS51151736A (en) 1976-12-27
JPS555856B2 true JPS555856B2 (US06492441-20021210-C00072.png) 1980-02-12

Family

ID=13593051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7601775A Granted JPS51151736A (en) 1975-06-21 1975-06-21 Automatic applicator of adhesives

Country Status (1)

Country Link
JP (1) JPS51151736A (US06492441-20021210-C00072.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071768B2 (ja) * 1986-08-06 1995-01-11 三菱電機株式会社 樹脂ボンデイング装置におけるボンデイング樹脂面の調整装置
US6258416B1 (en) 1996-06-28 2001-07-10 Metalspray U.S.A., Inc. Method for forming a coating on a substrate by thermal spraying

Also Published As

Publication number Publication date
JPS51151736A (en) 1976-12-27

Similar Documents

Publication Publication Date Title
AU498145B2 (en) An anaerobically polymerizable adhesive composition
ZA762870B (en) Adhesives
AU509853B2 (en) Adhesive anchor
JPS51127132A (en) Pressureesensitive adhesive composition
JPS5258739A (en) Adhesive composition
IL49774A0 (en) A substrate for the quantitative determination of enzymes
JPS524441A (en) Corrosion depressing method
JPS5281350A (en) Adhesive composition
ZA76186B (en) Stabilized quick set adhesives
GB1552833A (en) Adhesives
JPS5221240A (en) Method of coating thin plate
GB1556705A (en) Adhesives
GB1549856A (en) Phosphating process
JPS51114438A (en) Reactive hot-melt adhesives
CA1035068A (en) Adhesive composition
JPS555856B2 (US06492441-20021210-C00072.png)
GB1557779A (en) Phosphating process
JPS5222196A (en) Hob
GB1547228A (en) Adhesives
AU500959B2 (en) Applying lubricants to metallic substrates
JPS5228798A (en) Hob
AU507110B2 (en) Phosphating process
ZA766225B (en) Coated electrodes
JPS51114417A (en) Process for applying coating material
JPS523394A (en) Piezo-vibrator