JPS554911A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS554911A
JPS554911A JP7646678A JP7646678A JPS554911A JP S554911 A JPS554911 A JP S554911A JP 7646678 A JP7646678 A JP 7646678A JP 7646678 A JP7646678 A JP 7646678A JP S554911 A JPS554911 A JP S554911A
Authority
JP
Japan
Prior art keywords
lead plates
plates
lead
pair
ears
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7646678A
Other languages
English (en)
Other versions
JPS603784B2 (ja
Inventor
Hiroshi Takao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP53076466A priority Critical patent/JPS603784B2/ja
Publication of JPS554911A publication Critical patent/JPS554911A/ja
Publication of JPS603784B2 publication Critical patent/JPS603784B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/15165Monolayer substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP53076466A 1978-06-26 1978-06-26 リ−ドフレ−ム Expired JPS603784B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53076466A JPS603784B2 (ja) 1978-06-26 1978-06-26 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53076466A JPS603784B2 (ja) 1978-06-26 1978-06-26 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS554911A true JPS554911A (en) 1980-01-14
JPS603784B2 JPS603784B2 (ja) 1985-01-30

Family

ID=13605933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53076466A Expired JPS603784B2 (ja) 1978-06-26 1978-06-26 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS603784B2 (ja)

Also Published As

Publication number Publication date
JPS603784B2 (ja) 1985-01-30

Similar Documents

Publication Publication Date Title
IT8026298A0 (it) Apparato per regolare la corrente fornita ad una linea telefonica.
IT8024697A0 (it) Metodo per l'esecuzione di una marcatura, leggibile con l'ausilio di una macchina, in un pezzo in lavorazione.
BE892129A (fr) Pneumatique, notamment pour avions, avec armature de sommet en cables textiles, et procede pour le fabriquer
DE3381806D1 (de) Numerisch gesteuerte werkzeugmaschine, die zwischenmessungen ausfuehrt.
IT1178460B (it) Matrice universale automatizzata, a geometria variabile
ATE35782T1 (de) Vorrichtung zum bearbeiten von bandmaterial.
DE3165141D1 (en) Process for doping semiconductors rapidly
IT7924389A0 (it) Macchina utensile per lavorazioni molteplici.
YU87579A (en) Process for preparing n,n,n,n-tetraacetyl-ethylene diamine
IT8122644A0 (it) Macchina fustellatrice.
JPS554911A (en) Lead frame
IT7926531A0 (it) Dispositivo e procedimento di collegamento di due elementi, ed utensile per l'esecuzione del procedimento.
IT7924404A0 (it) Filiera per macchine per il tagliodi filettature esterne.
DE3466322D1 (en) Process for fabricating bipolar transistor
EP0054195A3 (en) Process for preparing 1-amino-alkane-1,1-diphosphonic acid
DE3484269D1 (de) Vorrichtung zum herstellen von kabelbaeumen.
BR8107821A (pt) Processo de producao de 2,3-diidro-1,4-ditiinas
JPS55146951A (en) Lead frame
DE3161441D1 (en) Process for preparing 1,4-diamino-anthraquinone-2-sulphonic acid
ATE21373T1 (de) Vorrichtung zum herstellen einer verbindung zwischen jeweils zwei von mehreren stationen.
IT7948548A0 (it) Dispositivo di avanzamento in macchine utensili in particolar modo in presse
IT8119961A0 (it) Fustellatrice piana.
JPS56133860A (en) Manufacture of lead frame for semiconductor device
ES511026A0 (es) "maquina insertora de varillas roscadas, actuantes como nexos de union entre piezas de madera".
GB2077729B (en) Process for preparing high assay dicamba