JPS5533657Y2 - - Google Patents
Info
- Publication number
- JPS5533657Y2 JPS5533657Y2 JP1975148782U JP14878275U JPS5533657Y2 JP S5533657 Y2 JPS5533657 Y2 JP S5533657Y2 JP 1975148782 U JP1975148782 U JP 1975148782U JP 14878275 U JP14878275 U JP 14878275U JP S5533657 Y2 JPS5533657 Y2 JP S5533657Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/016—Manufacture or treatment of strap connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/076—Connecting or disconnecting of strap connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975148782U JPS5533657Y2 (https=) | 1975-10-30 | 1975-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975148782U JPS5533657Y2 (https=) | 1975-10-30 | 1975-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5260268U JPS5260268U (https=) | 1977-05-02 |
| JPS5533657Y2 true JPS5533657Y2 (https=) | 1980-08-09 |
Family
ID=28628311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975148782U Expired JPS5533657Y2 (https=) | 1975-10-30 | 1975-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5533657Y2 (https=) |
-
1975
- 1975-10-30 JP JP1975148782U patent/JPS5533657Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5260268U (https=) | 1977-05-02 |