JPS55176566U - - Google Patents

Info

Publication number
JPS55176566U
JPS55176566U JP1979076336U JP7633679U JPS55176566U JP S55176566 U JPS55176566 U JP S55176566U JP 1979076336 U JP1979076336 U JP 1979076336U JP 7633679 U JP7633679 U JP 7633679U JP S55176566 U JPS55176566 U JP S55176566U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979076336U
Other languages
Japanese (ja)
Other versions
JPS6314468Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979076336U priority Critical patent/JPS6314468Y2/ja
Publication of JPS55176566U publication Critical patent/JPS55176566U/ja
Application granted granted Critical
Publication of JPS6314468Y2 publication Critical patent/JPS6314468Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331Disposition
    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181On opposite sides of the body

Landscapes

  • Die Bonding (AREA)
JP1979076336U 1979-06-05 1979-06-05 Expired JPS6314468Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979076336U JPS6314468Y2 (enrdf_load_stackoverflow) 1979-06-05 1979-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979076336U JPS6314468Y2 (enrdf_load_stackoverflow) 1979-06-05 1979-06-05

Publications (2)

Publication Number Publication Date
JPS55176566U true JPS55176566U (enrdf_load_stackoverflow) 1980-12-18
JPS6314468Y2 JPS6314468Y2 (enrdf_load_stackoverflow) 1988-04-22

Family

ID=29309837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979076336U Expired JPS6314468Y2 (enrdf_load_stackoverflow) 1979-06-05 1979-06-05

Country Status (1)

Country Link
JP (1) JPS6314468Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6314468Y2 (enrdf_load_stackoverflow) 1988-04-22

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