JPS5515826A - Polyimide film provided with heattproof adhesive layer - Google Patents
Polyimide film provided with heattproof adhesive layerInfo
- Publication number
- JPS5515826A JPS5515826A JP8836578A JP8836578A JPS5515826A JP S5515826 A JPS5515826 A JP S5515826A JP 8836578 A JP8836578 A JP 8836578A JP 8836578 A JP8836578 A JP 8836578A JP S5515826 A JPS5515826 A JP S5515826A
- Authority
- JP
- Japan
- Prior art keywords
- heattproof
- adhesive layer
- polyimide film
- film provided
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8836578A JPS6030353B2 (en) | 1978-07-21 | 1978-07-21 | Polyimide film with heat-resistant adhesive layer |
US06/010,290 US4377652A (en) | 1978-02-17 | 1979-02-08 | Polyamide-imide compositions and articles for electrical use prepared therefrom |
GB7904632A GB2016487B (en) | 1978-02-17 | 1979-02-09 | Articles for electrical use and compositions useful therefor |
DE2905857A DE2905857C2 (en) | 1978-02-17 | 1979-02-15 | Polyamide-imide compositions with granular materials and use of such compositions for electrical components, circuit boards and insulating substrates |
CA321,623A CA1123981A (en) | 1978-02-17 | 1979-02-16 | Soluble aromatic polyamide-imide compositions for electrical use |
NLAANVRAGE7901256,A NL181739C (en) | 1978-02-17 | 1979-02-16 | COMPOSITION BASED ON AN AROMATIC POLYAMIDE IMIDE. |
CA000384856A CA1143084A (en) | 1978-02-17 | 1981-08-28 | Soluble aromatic polyamide-imide compositions for electrical use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8836578A JPS6030353B2 (en) | 1978-07-21 | 1978-07-21 | Polyimide film with heat-resistant adhesive layer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5515826A true JPS5515826A (en) | 1980-02-04 |
JPS6030353B2 JPS6030353B2 (en) | 1985-07-16 |
Family
ID=13940766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8836578A Expired JPS6030353B2 (en) | 1978-02-17 | 1978-07-21 | Polyimide film with heat-resistant adhesive layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6030353B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01268778A (en) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom |
JPH02222478A (en) * | 1989-02-23 | 1990-09-05 | Tomoegawa Paper Co Ltd | Adhesive tape |
US5824182A (en) * | 1988-09-29 | 1998-10-20 | Tomoegawa Paper Co., Ltd. | Adhesive tapes |
-
1978
- 1978-07-21 JP JP8836578A patent/JPS6030353B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01268778A (en) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom |
US5824182A (en) * | 1988-09-29 | 1998-10-20 | Tomoegawa Paper Co., Ltd. | Adhesive tapes |
JPH02222478A (en) * | 1989-02-23 | 1990-09-05 | Tomoegawa Paper Co Ltd | Adhesive tape |
Also Published As
Publication number | Publication date |
---|---|
JPS6030353B2 (en) | 1985-07-16 |
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