JPS5514760U - - Google Patents
Info
- Publication number
- JPS5514760U JPS5514760U JP9771578U JP9771578U JPS5514760U JP S5514760 U JPS5514760 U JP S5514760U JP 9771578 U JP9771578 U JP 9771578U JP 9771578 U JP9771578 U JP 9771578U JP S5514760 U JPS5514760 U JP S5514760U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9771578U JPS5514760U (US06252093-20010626-C00008.png) | 1978-07-14 | 1978-07-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9771578U JPS5514760U (US06252093-20010626-C00008.png) | 1978-07-14 | 1978-07-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5514760U true JPS5514760U (US06252093-20010626-C00008.png) | 1980-01-30 |
Family
ID=29032811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9771578U Pending JPS5514760U (US06252093-20010626-C00008.png) | 1978-07-14 | 1978-07-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5514760U (US06252093-20010626-C00008.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57176651U (US06252093-20010626-C00008.png) * | 1981-05-01 | 1982-11-08 | ||
JPS5986344U (ja) * | 1982-12-01 | 1984-06-11 | 日産自動車株式会社 | シリンダガスケツト |
JPH01154364U (US06252093-20010626-C00008.png) * | 1988-04-15 | 1989-10-24 |
-
1978
- 1978-07-14 JP JP9771578U patent/JPS5514760U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57176651U (US06252093-20010626-C00008.png) * | 1981-05-01 | 1982-11-08 | ||
JPS5986344U (ja) * | 1982-12-01 | 1984-06-11 | 日産自動車株式会社 | シリンダガスケツト |
JPH01154364U (US06252093-20010626-C00008.png) * | 1988-04-15 | 1989-10-24 |