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Filing date
Publication date
Application filedfiledCritical
Priority to JP7120676ApriorityCriticalpatent/JPS52155057A/ja
Publication of JPS52155057ApublicationCriticalpatent/JPS52155057A/ja
Publication of JPS5514535B2publicationCriticalpatent/JPS5514535B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
JP7120676A1976-06-181976-06-18Glass sealed type semiconductor device
GrantedJPS52155057A
(en)