JPS55105550A - Dry-process production of molding board - Google Patents

Dry-process production of molding board

Info

Publication number
JPS55105550A
JPS55105550A JP818679A JP818679A JPS55105550A JP S55105550 A JPS55105550 A JP S55105550A JP 818679 A JP818679 A JP 818679A JP 818679 A JP818679 A JP 818679A JP S55105550 A JPS55105550 A JP S55105550A
Authority
JP
Japan
Prior art keywords
pulverous
fleece
molding board
formaldehyde resin
type phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP818679A
Other languages
Japanese (ja)
Other versions
JPS5628707B2 (en
Inventor
Terunobu Ubukata
Sadaichi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gun Ei Chemical Industry Co Ltd
Original Assignee
Gun Ei Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gun Ei Chemical Industry Co Ltd filed Critical Gun Ei Chemical Industry Co Ltd
Priority to JP818679A priority Critical patent/JPS55105550A/en
Publication of JPS55105550A publication Critical patent/JPS55105550A/en
Publication of JPS5628707B2 publication Critical patent/JPS5628707B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

PURPOSE: To improve water resistance and heat resistance of the molding board by using a pulverous resol type phenol-formaldehyde resin as binder in the production of the molding board according to a dry process.
CONSTITUTION: A molding board is produced according to a dry process by using as binder a pulverous resol type phenol-formaldehyde resin having 50W90°C melting point, 0.1W1.5 nitrogen bond index and 0.2W1.0 methylol group index. For instance, 60pts.wt. wood pulp, 20pts.wt. cotton and 20pts.wt. hemp are subjected to sufficient fiber-opening by using a rag opener, and after adding thereto 24pts.wt. a pulverous resol type phenol-formaldehyde resin having 65°C melting point, 0.3 nitrogen bond index and 0.7 methylol group index, the mixture is molded by a fleece molding machine to form a bulky fleece. This fleece is pressed under 30W 40kg/cm2 at 190W210°C for 40W60 seconds and, 15 seconds thereafter, degassed one time to obtain a board with 2mm thickness and 0.7 density.
COPYRIGHT: (C)1980,JPO&Japio
JP818679A 1979-01-29 1979-01-29 Dry-process production of molding board Granted JPS55105550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP818679A JPS55105550A (en) 1979-01-29 1979-01-29 Dry-process production of molding board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP818679A JPS55105550A (en) 1979-01-29 1979-01-29 Dry-process production of molding board

Publications (2)

Publication Number Publication Date
JPS55105550A true JPS55105550A (en) 1980-08-13
JPS5628707B2 JPS5628707B2 (en) 1981-07-03

Family

ID=11686264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP818679A Granted JPS55105550A (en) 1979-01-29 1979-01-29 Dry-process production of molding board

Country Status (1)

Country Link
JP (1) JPS55105550A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55124641A (en) * 1979-03-20 1980-09-25 Gunei Kagaku Kogyo Kk Manufacturing method of group of alkali-proof board
CN110446763A (en) * 2017-03-22 2019-11-12 乌兰涂料株式会社 Adjust the mold coating agent with concrete remover function of acid value

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5155476A (en) * 1974-11-11 1976-05-15 Heiwa Takaron Kk Seikeirejinfueruto tosono seizohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5155476A (en) * 1974-11-11 1976-05-15 Heiwa Takaron Kk Seikeirejinfueruto tosono seizohoho

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55124641A (en) * 1979-03-20 1980-09-25 Gunei Kagaku Kogyo Kk Manufacturing method of group of alkali-proof board
JPS5628708B2 (en) * 1979-03-20 1981-07-03
CN110446763A (en) * 2017-03-22 2019-11-12 乌兰涂料株式会社 Adjust the mold coating agent with concrete remover function of acid value
CN110446763B (en) * 2017-03-22 2021-10-01 乌兰涂料株式会社 Mold coating agent with function of concrete stripping agent for adjusting acid value

Also Published As

Publication number Publication date
JPS5628707B2 (en) 1981-07-03

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