JPS5436623Y2 - - Google Patents
Info
- Publication number
- JPS5436623Y2 JPS5436623Y2 JP5906975U JP5906975U JPS5436623Y2 JP S5436623 Y2 JPS5436623 Y2 JP S5436623Y2 JP 5906975 U JP5906975 U JP 5906975U JP 5906975 U JP5906975 U JP 5906975U JP S5436623 Y2 JPS5436623 Y2 JP S5436623Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5906975U JPS5436623Y2 (ko) | 1975-04-30 | 1975-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5906975U JPS5436623Y2 (ko) | 1975-04-30 | 1975-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51140058U JPS51140058U (ko) | 1976-11-11 |
JPS5436623Y2 true JPS5436623Y2 (ko) | 1979-11-05 |
Family
ID=28518475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5906975U Expired JPS5436623Y2 (ko) | 1975-04-30 | 1975-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5436623Y2 (ko) |
-
1975
- 1975-04-30 JP JP5906975U patent/JPS5436623Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS51140058U (ko) | 1976-11-11 |