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Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP50045022ApriorityCriticalpatent/JPS51120176A/ja
Publication of JPS51120176ApublicationCriticalpatent/JPS51120176A/ja
Publication of JPS5424823B2publicationCriticalpatent/JPS5424823B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/78—Apparatus for connecting with wire connectors
H01L2224/7825—Means for applying energy, e.g. heating means
H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
H01L2224/78301—Capillary
Landscapes
Testing Or Measuring Of Semiconductors Or The Like
(AREA)
Wire Bonding
(AREA)
JP50045022A1975-04-141975-04-14Method of evaluating bonding characteristic of metal surfaces of micro electric parts
GrantedJPS51120176A
(en)
