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Priority to JP3415775ApriorityCriticalpatent/JPS51109775A/ja
Publication of JPS51109775ApublicationCriticalpatent/JPS51109775A/ja
Publication of JPS5424822B2publicationCriticalpatent/JPS5424822B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H01L2224/8119—Arrangement of the bump connectors prior to mounting
H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
