JPS541661U - - Google Patents
Info
- Publication number
- JPS541661U JPS541661U JP7412977U JP7412977U JPS541661U JP S541661 U JPS541661 U JP S541661U JP 7412977 U JP7412977 U JP 7412977U JP 7412977 U JP7412977 U JP 7412977U JP S541661 U JPS541661 U JP S541661U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7412977U JPS541661U (https=) | 1977-06-06 | 1977-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7412977U JPS541661U (https=) | 1977-06-06 | 1977-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS541661U true JPS541661U (https=) | 1979-01-08 |
Family
ID=28987379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7412977U Pending JPS541661U (https=) | 1977-06-06 | 1977-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS541661U (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02292126A (ja) * | 1989-04-27 | 1990-12-03 | Kochi Pref Gov | ワークの表面加工方法及びその装置 |
| JP2021115667A (ja) * | 2020-01-27 | 2021-08-10 | 康弘 藤村 | 玉葱切断具及び玉葱の切断方法 |
| KR20230143167A (ko) | 2021-02-10 | 2023-10-11 | 캐논 아네르바 가부시키가이샤 | 화학 결합법 및 패키지형 전자 부품, 그리고 전자 디바이스의 하이브리드 접합법 |
-
1977
- 1977-06-06 JP JP7412977U patent/JPS541661U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02292126A (ja) * | 1989-04-27 | 1990-12-03 | Kochi Pref Gov | ワークの表面加工方法及びその装置 |
| JP2021115667A (ja) * | 2020-01-27 | 2021-08-10 | 康弘 藤村 | 玉葱切断具及び玉葱の切断方法 |
| KR20230143167A (ko) | 2021-02-10 | 2023-10-11 | 캐논 아네르바 가부시키가이샤 | 화학 결합법 및 패키지형 전자 부품, 그리고 전자 디바이스의 하이브리드 접합법 |