JPS5415256U - - Google Patents
Info
- Publication number
- JPS5415256U JPS5415256U JP1977089021U JP8902177U JPS5415256U JP S5415256 U JPS5415256 U JP S5415256U JP 1977089021 U JP1977089021 U JP 1977089021U JP 8902177 U JP8902177 U JP 8902177U JP S5415256 U JPS5415256 U JP S5415256U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977089021U JPS5647957Y2 (https=) | 1977-07-05 | 1977-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977089021U JPS5647957Y2 (https=) | 1977-07-05 | 1977-07-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5415256U true JPS5415256U (https=) | 1979-01-31 |
| JPS5647957Y2 JPS5647957Y2 (https=) | 1981-11-10 |
Family
ID=29016045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977089021U Expired JPS5647957Y2 (https=) | 1977-07-05 | 1977-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5647957Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010015618A (ja) * | 2008-07-01 | 2010-01-21 | Nitto Denko Corp | 回路付サスペンション基板およびその製造方法 |
| JP2016143710A (ja) * | 2015-01-30 | 2016-08-08 | シチズンファインデバイス株式会社 | 電子部品のワイヤー接続構造 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4837356U (https=) * | 1971-09-08 | 1973-05-07 |
-
1977
- 1977-07-05 JP JP1977089021U patent/JPS5647957Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4837356U (https=) * | 1971-09-08 | 1973-05-07 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010015618A (ja) * | 2008-07-01 | 2010-01-21 | Nitto Denko Corp | 回路付サスペンション基板およびその製造方法 |
| JP2016143710A (ja) * | 2015-01-30 | 2016-08-08 | シチズンファインデバイス株式会社 | 電子部品のワイヤー接続構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5647957Y2 (https=) | 1981-11-10 |