JPS54124853A - Press contacting method and apparatus of minute metal strain - Google Patents
Press contacting method and apparatus of minute metal strainInfo
- Publication number
- JPS54124853A JPS54124853A JP3241678A JP3241678A JPS54124853A JP S54124853 A JPS54124853 A JP S54124853A JP 3241678 A JP3241678 A JP 3241678A JP 3241678 A JP3241678 A JP 3241678A JP S54124853 A JPS54124853 A JP S54124853A
- Authority
- JP
- Japan
- Prior art keywords
- contacting method
- metal strain
- minute metal
- press contacting
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3241678A JPS54124853A (en) | 1978-03-23 | 1978-03-23 | Press contacting method and apparatus of minute metal strain |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3241678A JPS54124853A (en) | 1978-03-23 | 1978-03-23 | Press contacting method and apparatus of minute metal strain |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54124853A true JPS54124853A (en) | 1979-09-28 |
| JPS6222712B2 JPS6222712B2 (enrdf_load_stackoverflow) | 1987-05-19 |
Family
ID=12358337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3241678A Granted JPS54124853A (en) | 1978-03-23 | 1978-03-23 | Press contacting method and apparatus of minute metal strain |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54124853A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615598A (ja) * | 1984-03-06 | 1986-01-11 | ア−エスエム フイコ ツ−リング ベスロ−テン フエン ノ−トチヤツプ | リードピン等を浄化する方法 |
| JPS62282790A (ja) * | 1986-05-29 | 1987-12-08 | Mitsubishi Electric Corp | 固相接合装置 |
| JPH02224882A (ja) * | 1989-02-23 | 1990-09-06 | Ishikawajima Harima Heavy Ind Co Ltd | 常温固相接合法 |
| US6245249B1 (en) | 1997-05-01 | 2001-06-12 | Fuji Xerox Co., Ltd. | Micro-structure and manufacturing method and apparatus |
| WO2002074531A1 (fr) * | 2001-03-16 | 2002-09-26 | Toyo Kohan Co., Ltd. | Plaque de haut polymere et corps de connexion de plaque conductrice et partie utilisant cette plaque de connexion |
| WO2008029885A1 (fr) | 2006-09-06 | 2008-03-13 | Mitsubishi Heavy Industries, Ltd. | Procédé d'assemblage à température normale et dispositif d'assemblage à température normale |
| JP2008302370A (ja) * | 2007-06-05 | 2008-12-18 | Panasonic Corp | 接合方法 |
| US7645681B2 (en) | 2003-12-02 | 2010-01-12 | Bondtech, Inc. | Bonding method, device produced by this method, and bonding device |
| JP2017216469A (ja) * | 2017-07-21 | 2017-12-07 | 須賀 唯知 | 金属領域を有する基板の接合方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4162094B2 (ja) | 2006-05-30 | 2008-10-08 | 三菱重工業株式会社 | 常温接合によるデバイス、デバイス製造方法ならびに常温接合装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5096447A (enrdf_load_stackoverflow) * | 1973-12-28 | 1975-07-31 |
-
1978
- 1978-03-23 JP JP3241678A patent/JPS54124853A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5096447A (enrdf_load_stackoverflow) * | 1973-12-28 | 1975-07-31 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615598A (ja) * | 1984-03-06 | 1986-01-11 | ア−エスエム フイコ ツ−リング ベスロ−テン フエン ノ−トチヤツプ | リードピン等を浄化する方法 |
| JPS62282790A (ja) * | 1986-05-29 | 1987-12-08 | Mitsubishi Electric Corp | 固相接合装置 |
| JPH02224882A (ja) * | 1989-02-23 | 1990-09-06 | Ishikawajima Harima Heavy Ind Co Ltd | 常温固相接合法 |
| US6245249B1 (en) | 1997-05-01 | 2001-06-12 | Fuji Xerox Co., Ltd. | Micro-structure and manufacturing method and apparatus |
| US6557607B2 (en) | 1997-05-01 | 2003-05-06 | Fuji Xerox Co., Ltd. | Apparatus for manufacturing micro-structure |
| WO2002074531A1 (fr) * | 2001-03-16 | 2002-09-26 | Toyo Kohan Co., Ltd. | Plaque de haut polymere et corps de connexion de plaque conductrice et partie utilisant cette plaque de connexion |
| US7645681B2 (en) | 2003-12-02 | 2010-01-12 | Bondtech, Inc. | Bonding method, device produced by this method, and bonding device |
| WO2008029885A1 (fr) | 2006-09-06 | 2008-03-13 | Mitsubishi Heavy Industries, Ltd. | Procédé d'assemblage à température normale et dispositif d'assemblage à température normale |
| JP2008302370A (ja) * | 2007-06-05 | 2008-12-18 | Panasonic Corp | 接合方法 |
| JP2017216469A (ja) * | 2017-07-21 | 2017-12-07 | 須賀 唯知 | 金属領域を有する基板の接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6222712B2 (enrdf_load_stackoverflow) | 1987-05-19 |
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