JPS54111769A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54111769A
JPS54111769A JP1920378A JP1920378A JPS54111769A JP S54111769 A JPS54111769 A JP S54111769A JP 1920378 A JP1920378 A JP 1920378A JP 1920378 A JP1920378 A JP 1920378A JP S54111769 A JPS54111769 A JP S54111769A
Authority
JP
Japan
Prior art keywords
cap
substrate
ceramic
external appearance
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1920378A
Other languages
Japanese (ja)
Other versions
JPS6042617B2 (en
Inventor
Kazuo Usada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1920378A priority Critical patent/JPS6042617B2/en
Publication of JPS54111769A publication Critical patent/JPS54111769A/en
Publication of JPS6042617B2 publication Critical patent/JPS6042617B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To improve the air-tightness, working performance and external appearance, in covering the semiconductor chip fixed on the mounting substrate with ceramic cap and further resin coating.
CONSTITUTION: The ceramic cap 4 is bonded on the ceramic substrate 2 and the liquid resin 8 so suitable amount is put in the Al cap 7. The cap 7 has the area just fitted to the substrate 2, the depth has the same surface as the rear side of the substrate 2 for the edge of the cap 7 when the device is inserted in the cap 7 by taking up side down and the cap 4 is incontact with the bottom surface. The device is inserted to the cap 7 and resin is hardened with suitable heat treatment, finishing the work. Thus, sealing is made with excellent air tightness, the working is good and external appearance is excellent.
COPYRIGHT: (C)1979,JPO&Japio
JP1920378A 1978-02-22 1978-02-22 semiconductor equipment Expired JPS6042617B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1920378A JPS6042617B2 (en) 1978-02-22 1978-02-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1920378A JPS6042617B2 (en) 1978-02-22 1978-02-22 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS54111769A true JPS54111769A (en) 1979-09-01
JPS6042617B2 JPS6042617B2 (en) 1985-09-24

Family

ID=11992789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1920378A Expired JPS6042617B2 (en) 1978-02-22 1978-02-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6042617B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102617U (en) * 1985-12-17 1987-06-30
JPS63114616A (en) * 1986-10-31 1988-05-19 Mazda Motor Corp Injection mold
CN107303717B (en) 2016-04-19 2019-08-06 株式会社技术可拉茨 Undercut processing mechanism, mold for forming and molded product

Also Published As

Publication number Publication date
JPS6042617B2 (en) 1985-09-24

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