JPS54111769A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54111769A JPS54111769A JP1920378A JP1920378A JPS54111769A JP S54111769 A JPS54111769 A JP S54111769A JP 1920378 A JP1920378 A JP 1920378A JP 1920378 A JP1920378 A JP 1920378A JP S54111769 A JPS54111769 A JP S54111769A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- substrate
- ceramic
- external appearance
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To improve the air-tightness, working performance and external appearance, in covering the semiconductor chip fixed on the mounting substrate with ceramic cap and further resin coating.
CONSTITUTION: The ceramic cap 4 is bonded on the ceramic substrate 2 and the liquid resin 8 so suitable amount is put in the Al cap 7. The cap 7 has the area just fitted to the substrate 2, the depth has the same surface as the rear side of the substrate 2 for the edge of the cap 7 when the device is inserted in the cap 7 by taking up side down and the cap 4 is incontact with the bottom surface. The device is inserted to the cap 7 and resin is hardened with suitable heat treatment, finishing the work. Thus, sealing is made with excellent air tightness, the working is good and external appearance is excellent.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1920378A JPS6042617B2 (en) | 1978-02-22 | 1978-02-22 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1920378A JPS6042617B2 (en) | 1978-02-22 | 1978-02-22 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54111769A true JPS54111769A (en) | 1979-09-01 |
JPS6042617B2 JPS6042617B2 (en) | 1985-09-24 |
Family
ID=11992789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1920378A Expired JPS6042617B2 (en) | 1978-02-22 | 1978-02-22 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6042617B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62102617U (en) * | 1985-12-17 | 1987-06-30 | ||
JPS63114616A (en) * | 1986-10-31 | 1988-05-19 | Mazda Motor Corp | Injection mold |
CN107303717B (en) | 2016-04-19 | 2019-08-06 | 株式会社技术可拉茨 | Undercut processing mechanism, mold for forming and molded product |
-
1978
- 1978-02-22 JP JP1920378A patent/JPS6042617B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6042617B2 (en) | 1985-09-24 |
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