JPS54101266A - Lead molder for glass package type semiconductor device manufacture - Google Patents
Lead molder for glass package type semiconductor device manufactureInfo
- Publication number
- JPS54101266A JPS54101266A JP724178A JP724178A JPS54101266A JP S54101266 A JPS54101266 A JP S54101266A JP 724178 A JP724178 A JP 724178A JP 724178 A JP724178 A JP 724178A JP S54101266 A JPS54101266 A JP S54101266A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- molder
- semiconductor device
- type semiconductor
- package type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To establish the shaper which can correctly folds the leads from the center of small hole with good working operation.
CONSTITUTION: The die 5 is provided with the cutting die part 9 to cut off the lead 1 from the lead frame 4, and also with the punch 12 having the cutting and folding blades 10 and 11 which drops and inserts in the gap and the die 5. Further, the angle of slope on the tilt surface 15 for the blades 10 and 11 is small (e.g. 6 degrees), the lead folding curved edge 14 is constituted with two steps, and the corner is the curved surface consisting of the curvature 0.5 to 1mm in radius.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP724178A JPS54101266A (en) | 1978-01-27 | 1978-01-27 | Lead molder for glass package type semiconductor device manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP724178A JPS54101266A (en) | 1978-01-27 | 1978-01-27 | Lead molder for glass package type semiconductor device manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54101266A true JPS54101266A (en) | 1979-08-09 |
Family
ID=11660497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP724178A Pending JPS54101266A (en) | 1978-01-27 | 1978-01-27 | Lead molder for glass package type semiconductor device manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54101266A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840845U (en) * | 1981-09-11 | 1983-03-17 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | Lead bending device for semiconductor molded products |
JPS6052090A (en) * | 1984-07-23 | 1985-03-23 | 株式会社日立製作所 | Lead cutting and shaping mechanism |
JPS6127253U (en) * | 1984-07-17 | 1986-02-18 | 東亞特殊電機株式会社 | Terminal bending and cutting device |
JPS6234444U (en) * | 1985-08-19 | 1987-02-28 | ||
US5070916A (en) * | 1990-06-11 | 1991-12-10 | Universal Instruments Corporation | Apparatus for processing a molded carrier ring device |
US5271146A (en) * | 1990-07-06 | 1993-12-21 | Matsushita Electric Industrial Co., Ltd. | Electronic component supplying apparatus |
-
1978
- 1978-01-27 JP JP724178A patent/JPS54101266A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840845U (en) * | 1981-09-11 | 1983-03-17 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | Lead bending device for semiconductor molded products |
JPS6331408Y2 (en) * | 1981-09-11 | 1988-08-22 | ||
JPS6127253U (en) * | 1984-07-17 | 1986-02-18 | 東亞特殊電機株式会社 | Terminal bending and cutting device |
JPS6052090A (en) * | 1984-07-23 | 1985-03-23 | 株式会社日立製作所 | Lead cutting and shaping mechanism |
JPS6234444U (en) * | 1985-08-19 | 1987-02-28 | ||
US5070916A (en) * | 1990-06-11 | 1991-12-10 | Universal Instruments Corporation | Apparatus for processing a molded carrier ring device |
US5271146A (en) * | 1990-07-06 | 1993-12-21 | Matsushita Electric Industrial Co., Ltd. | Electronic component supplying apparatus |
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