JPS54101266A - Lead molder for glass package type semiconductor device manufacture - Google Patents

Lead molder for glass package type semiconductor device manufacture

Info

Publication number
JPS54101266A
JPS54101266A JP724178A JP724178A JPS54101266A JP S54101266 A JPS54101266 A JP S54101266A JP 724178 A JP724178 A JP 724178A JP 724178 A JP724178 A JP 724178A JP S54101266 A JPS54101266 A JP S54101266A
Authority
JP
Japan
Prior art keywords
lead
molder
semiconductor device
type semiconductor
package type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP724178A
Other languages
Japanese (ja)
Inventor
Katsuhiro Tabata
Takeshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP724178A priority Critical patent/JPS54101266A/en
Publication of JPS54101266A publication Critical patent/JPS54101266A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To establish the shaper which can correctly folds the leads from the center of small hole with good working operation.
CONSTITUTION: The die 5 is provided with the cutting die part 9 to cut off the lead 1 from the lead frame 4, and also with the punch 12 having the cutting and folding blades 10 and 11 which drops and inserts in the gap and the die 5. Further, the angle of slope on the tilt surface 15 for the blades 10 and 11 is small (e.g. 6 degrees), the lead folding curved edge 14 is constituted with two steps, and the corner is the curved surface consisting of the curvature 0.5 to 1mm in radius.
COPYRIGHT: (C)1979,JPO&Japio
JP724178A 1978-01-27 1978-01-27 Lead molder for glass package type semiconductor device manufacture Pending JPS54101266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP724178A JPS54101266A (en) 1978-01-27 1978-01-27 Lead molder for glass package type semiconductor device manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP724178A JPS54101266A (en) 1978-01-27 1978-01-27 Lead molder for glass package type semiconductor device manufacture

Publications (1)

Publication Number Publication Date
JPS54101266A true JPS54101266A (en) 1979-08-09

Family

ID=11660497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP724178A Pending JPS54101266A (en) 1978-01-27 1978-01-27 Lead molder for glass package type semiconductor device manufacture

Country Status (1)

Country Link
JP (1) JPS54101266A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840845U (en) * 1981-09-11 1983-03-17 有限会社ティ・アンド・ケイ・インターナショナル研究所 Lead bending device for semiconductor molded products
JPS6052090A (en) * 1984-07-23 1985-03-23 株式会社日立製作所 Lead cutting and shaping mechanism
JPS6127253U (en) * 1984-07-17 1986-02-18 東亞特殊電機株式会社 Terminal bending and cutting device
JPS6234444U (en) * 1985-08-19 1987-02-28
US5070916A (en) * 1990-06-11 1991-12-10 Universal Instruments Corporation Apparatus for processing a molded carrier ring device
US5271146A (en) * 1990-07-06 1993-12-21 Matsushita Electric Industrial Co., Ltd. Electronic component supplying apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840845U (en) * 1981-09-11 1983-03-17 有限会社ティ・アンド・ケイ・インターナショナル研究所 Lead bending device for semiconductor molded products
JPS6331408Y2 (en) * 1981-09-11 1988-08-22
JPS6127253U (en) * 1984-07-17 1986-02-18 東亞特殊電機株式会社 Terminal bending and cutting device
JPS6052090A (en) * 1984-07-23 1985-03-23 株式会社日立製作所 Lead cutting and shaping mechanism
JPS6234444U (en) * 1985-08-19 1987-02-28
US5070916A (en) * 1990-06-11 1991-12-10 Universal Instruments Corporation Apparatus for processing a molded carrier ring device
US5271146A (en) * 1990-07-06 1993-12-21 Matsushita Electric Industrial Co., Ltd. Electronic component supplying apparatus

Similar Documents

Publication Publication Date Title
JPS54101266A (en) Lead molder for glass package type semiconductor device manufacture
USD278117S (en) Contoured pair of scissors
IE841071L (en) Self-protected thyristor
IT1292751B1 (en) PROCEDURE FOR MAKING ONE-PIECE CAPSULES IN PLASTIC MATERIAL.
EP0111291A2 (en) Diamond cutting element for an ultramicrotomy knife.
JPS53148787A (en) Device for cutting ceramic sheets
USD271025S (en) Combined ruler and electronic calculator
USD258016S (en) Slanted safety razor
USD269085S (en) Sheet metal blank used in the manufacture of polarized terminal blades
JPS53134558A (en) Reciprocating type electric razor
JPS56130944A (en) Diamond cutter
CA2094876A1 (en) Fish fin remover
USD276407S (en) Hack saw frame
JPS5699071A (en) Method and device for cutting and removing unnecessary part of cast product
JPS52105391A (en) Cutter
USD246568S (en) Blade holder tool for cutting a pour spout
JPS5351975A (en) Punch for semiconductor frame cut
JPS5687223A (en) Method of working head material
JPS5323565A (en) Production of bump semiconductor device
JPS5249186A (en) Method for continuously cutting unit packages having 1/4 arcute corner s from continuous vacuum package
USD279076S (en) Paper cutting knife
JPS54131324A (en) Combination of lateral frame with vertical frame of fence
JPS51137980A (en) High feed multiblade cutting tool
JPS52155483A (en) Cutting machine
JPS54162468A (en) Manufacture for semiconductor device