JPS5378166A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS5378166A
JPS5378166A JP15534776A JP15534776A JPS5378166A JP S5378166 A JPS5378166 A JP S5378166A JP 15534776 A JP15534776 A JP 15534776A JP 15534776 A JP15534776 A JP 15534776A JP S5378166 A JPS5378166 A JP S5378166A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
connector
connection
element electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15534776A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5711500B2 (enrdf_load_stackoverflow
Inventor
Yasuo Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP15534776A priority Critical patent/JPS5378166A/ja
Publication of JPS5378166A publication Critical patent/JPS5378166A/ja
Publication of JPS5711500B2 publication Critical patent/JPS5711500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Wire Bonding (AREA)
JP15534776A 1976-12-22 1976-12-22 Manufacture for semiconductor device Granted JPS5378166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15534776A JPS5378166A (en) 1976-12-22 1976-12-22 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15534776A JPS5378166A (en) 1976-12-22 1976-12-22 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5378166A true JPS5378166A (en) 1978-07-11
JPS5711500B2 JPS5711500B2 (enrdf_load_stackoverflow) 1982-03-04

Family

ID=15603891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15534776A Granted JPS5378166A (en) 1976-12-22 1976-12-22 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5378166A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5711500B2 (enrdf_load_stackoverflow) 1982-03-04

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